MAX19995ETX+T Maxim Integrated Products, MAX19995ETX+T Datasheet - Page 2

• Manufacturer Part Number: MAX19995ETX+T
• Description: RF Mixer IC DOWNCONVERTER 2CH earity, 1700MHz to 2
• Manufacturer: Maxim Integrated Products

Specifications of MAX19995ETX+T

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V
LO1, LO2 to GND ...............................................................±0.3V
Any Other Pins to GND...............................-0.3V to (V
RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm
RFMAIN, RFDIV Current (RF is DC shorted to GND
Continuous Power Dissipation (Note 1) ...............................8.7W
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit optimized for the DCS/PCS band, V
R5 = 2.32kΩ. Typical values are at V
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
V
Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
LOSEL Input High Voltage
LOSEL Input Low Voltage
Supply Voltage
Supply Current
LOSEL Input High Voltage
LOSEL Input Low Voltage
LOSEL Input Current
CC
CC
through a balun)...............................................................50mA
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
= +3.3V, T
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
layer board. For detailed information on package thermal considerations, refer to
C
PARAMETER
PARAMETER
is the temperature on the exposed pad of the package. T
C
= +25°C, unless otherwise noted. All parameters are guaranteed by design and not production tested.)
CC
J
= +3.0V to +3.6V, T
= T
CC
A
I
SYMBOL
SYMBOL
IH
+ (θ
= +5.0V, T
V
V
I
V
and I
I
V
V
V
CC
CC
J
CC
CC
IH
IH
IL
IL
JA
= T
x V
IL
C
+ (θ
CC
Total supply current, V
Total supply current, V
C
x I
JC
= +25°C, unless otherwise noted. All parameters are production tested.)
CC
C
CC
x V
= -40°C to +85°C, R1 = R4 = 909Ω, R2 = R5 = 2.49kΩ. Typical values are at
+ 0.3V)
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CC
CC
CONDITIONS
CONDITIONS
). This formula can be used when the temperature of the exposed
= +4.75V to +5.25V, T
A
θ
θ
Operating Case Temperature Range
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
JA
JC
is the ambient temperature of the device and PCB.
(Note 4) .............................................................-40°C to +85°C
CC
CC
(Notes 2, 3)..............................................................+38°C/W
(Notes 1, 3)...............................................................7.4°C/W
= +3.3V
= +5.0V
C
www.maxim-ic.com/thermal-tutorial.
= -40°C to +85°C. R1 = R4 = 806Ω, R2 =
4.75
MIN
MIN
-10
3.0
2
TYP
TYP
297
212
3.3
0.8
5
2
MAX
MAX
5.25
+10
370
0.8
3.6
UNITS
UNITS
mA
mA
µA
V
V
V
V
V
V