MAX19996AETP+T Maxim Integrated Products, MAX19996AETP+T Datasheet - Page 2

• Manufacturer Part Number: MAX19996AETP+T
• Description: RF Mixer IC DOWNCONVERTER SGL , High Gain, 2000MHz
• Manufacturer: Maxim Integrated Products

Specifications of MAX19996AETP+T

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SiGe, High-Linearity, 2000MHz to 3900MHz
Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V
IF+, IF-, LO to GND ....................................-0.3V to (V
RF, LO Input Power ........................................................+12dBm
RF, LO Current (RF and LO is DC shorted to GND
Continuous Power Dissipation (Note 1) ...............................5.0W
θ
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
are at V
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
at V
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
Supply Voltage
Supply Current
JA
Supply Voltage
Supply Current
CC
through a balun)...............................................................50mA
CC
(Notes 2, 3)..............................................................+38°C/W
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
= 3.3V, T
CC
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
= 5.0V, T
PARAMETER
is the temperature on the exposed pad of the package. T
C
= +25°C, parameters are guaranteed by design and not production tested, unless otherwise noted.)
C
= +25°C, all parameters are production tested.)
CC
CC
J
= 3.0V to 3.6V, no input AC signals. T
= 4.75V to 5.25V, no input AC signals. T
= T
A
SYMBOL
SYMBOL
+ (θ
V
I
V
I
CC
CC
CC
J
CC
JA
= T
x V
C
+ (θ
CC
Total supply current, V
x I
CC
JC
CC
x V
+ 0.3V)
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CC
CONDITIONS
CONDITIONS
). This formula can be used when the temperature of the exposed
A
θ
Operating Case Temperature
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
C
JC
is the ambient temperature of the device and PCB.
Range (Note 4).........................................T
= -40°C to +85°C, unless otherwise noted. Typical values are
CC
C
(Notes 1, 3)................................................................13°C/W
= -40°C to +85°C, unless otherwise noted. Typical values
= 3.3V
MIN
4.75
MIN
3.0
TYP
230
TYP
5.0
150
3.3
C
= -40°C to +85°C
MAX
5.25
MAX
245
3.6
UNITS
UNITS
mA
mA
V
V