MAX19998AETP+ Maxim Integrated Products, MAX19998AETP+ Datasheet - Page 2

• Manufacturer Part Number: MAX19998AETP+
• Description: RF Mixer SiGe High-Linearity 2300MHz to 4500MHz D
• Manufacturer: Maxim Integrated Products

Specifications of MAX19998AETP+

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
SiGe, High-Linearity, 2300MHz to 4000MHz
Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V
IF+, IF-, LOBIAS, IFBIAS to GND ............. -0.3V to (V
RF, LO Input Power ....................................................... +12dBm
RF, LO Current
Continuous Power Dissipation (Note 1) .................................5W
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, R1 = 698ω, R2 = 604ω, V
otherwise noted. Typical values are at V
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, R1 = 845ω, R2 = 1.1kω, V
erwise noted. Typical values are at V
RECOMMENDED AC OPERATING CONDITIONS
2
Supply Voltage
Supply Current
Supply Voltage
Supply Current
RF Frequency Range
LO Frequency
IF Frequency
LO Drive
CC
(RF and LO is DC shorted to GND through balun) ........50mA
______________________________________________________________________________________
to GND ..........................................................-0.3V to +5.5V
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
known. The junction temperature must not exceed +150NC.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
PARAMETER
PARAMETER
is the temperature on the exposed pad of the package. T
J
= T
CC
SYMBOL
A
SYMBOL
SYMBOL
+ (B
V
= 3.3V, T
I
P
CC
V
CC
f
I
f
CC
f
LO
CC
RF
LO
CC
IF
J
JA
= T
= 5.0V, T
x V
C
C
Total supply current
+ (B
(Notes 5, 6)
(Notes 5, 6)
Using a Mini-Circuits TC4-1W-17 4:1
transformer as defined in the Typical
Application Circuit, IF matching components
affect the IF frequency range (Notes 5, 6)
Using a Mini-Circuits TC4-1W-7A 4:1
transformer as defined in the Typical
Application Circuit, IF matching components
affect the IF frequency range (Notes 5, 6)
CC
Total supply current
= +25NC, parameters are guaranteed by design, unless otherwise noted.) (Note 5)
CC
x I
JC
C
CC
CC
= +25NC, all parameters are production tested.)
CC
+ 0.3V)
x V
= 3.0V to 3.6V, no input RF or LO signals. T
= 4.75V to 5.25V, no input RF or LO signals. T
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CONDITIONS
CONDITIONS
CONDITIONS
CC
). This formula can be used when the temperature of the
B
B
Operating Case Temperature Range
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
JA
JC
A
(Note 4) .................................................. T
is the ambient temperature of the device and PCB.
(Notes 2, 3) ............................................................ +38NC/W
(Notes 1, 3) ............................................................ +13NC/W
MIN
2300
2600
3.0
MIN
4.75
100
MIN
50
-3
C
= -40NC to +85NC, unless oth-
C
TYP
150
TYP
3.3
TYP
= -40NC to +85NC, unless
230
5.0
0
C
= -40NC to +85NC
MAX
MAX
4000
4300
MAX
3.6
5.25
500
250
247
+3
UNITS
UNITS
UNITS
dBm
MHz
MHz
MHz
mA
mA
V
V