MAX19996ETP+T Maxim Integrated Products, MAX19996ETP+T Datasheet - Page 2

• Manufacturer Part Number: MAX19996ETP+T
• Description: RF Mixer IC MIXER DOWNCONV-EP , High Gain, 2000MHz
• Manufacturer: Maxim Integrated Products

Specifications of MAX19996ETP+T

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SiGe High-Linearity, 2000MHz to 3000MHz
Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V
IF+, IF-, LOBIAS, LO, IFBIAS,
RF, LO Input Power ........................................................+12dBm
RF, LO Current
Continuous Power Dissipation (Note 1) ..............................5.0W
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
ues are at V
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
are at V
RECOMMENDED AC OPERATING CONDITIONS
Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
Supply Voltage
Supply Current
RF Frequency
LO Frequency
IF Frequency
LO Drive Level
CC
LEXT to GND ..........................................-0.3V to (V
(RF and LO is DC shorted to GND through a balun) ......50mA
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
CC
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
PARAMETER
PARAMETER
= +3.3V, T
CC
is the temperature on the exposed pad of the package. T
= +5.0V, T
C
= +25°C, parameters are guaranteed by design and not production tested, unless otherwise noted.)
C
= +25°C, all parameters are production tested.) (Note 6)
CC
CC
J
= +4.75V to +5.25V, no input AC signals. T
= +3.0V to +3.6V, no input AC signals. T
= T
A
SYMBOL
SYMBOL
SYMBOL
+ (θ
V
V
P
I
I
f
f
CC
CC
f
RF
LO
J
CC
CC
LO
IF
JA
= T
x V
C
+ (θ
CC
Total supply current, V
(Note 7)
(Note 7)
U si ng M i ni - C i r cui ts TC 4- 1W- 17 4:1 tr ansfor m er
as d efi ned i n the Typ i cal Ap p l i cati on C i r cui t, IF
m atchi ng com p onents affect the IF fr eq uency
r ang e ( N ote 7)
U si ng al ter nati ve M i ni - C i r cui ts TC 4- 1W- 7A
4:1 transformer, IF matching components
affect the IF frequency range (Note 7)
x I
JC
CC
CC
x V
+ 0.3V)
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CC
CONDITIONS
CONDITIONS
CONDITIONS
). This formula can be used when the temperature of the exposed
A
θ
θ
Operating Case Temperature
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
JA
JC
is the ambient temperature of the device and PCB.
Range (Note 4)........................................T
CC
(Notes 2, 3)..............................................................+38°C/W
(Notes 1, 3)................................................................13°C/W
C
= +3.3V
= -40°C to +85°C, unless otherwise noted. Typical values
C
= -40°C to +85°C, unless otherwise noted. Typical val-
2000
1800
4.75
MIN
MIN
MIN
100
3.0
50
-3
149.5
TYP
TYP
TYP
230
3.3
5
C
= -40°C to +85°C
MAX
MAX
MAX
3000
2550
5.25
500
250
245
3.6
+3
UNITS
UNITS
UNITS
MHz
MHz
MHz
dBm
mA
mA
V
V