MAX2031ETP+ Maxim Integrated Products, MAX2031ETP+ Datasheet - Page 18

• Manufacturer Part Number: MAX2031ETP+
• Description: Up-Down Converters IC MIXER UP/DWN HI LIN
• Manufacturer: Maxim Integrated Products

Specifications of MAX2031ETP+

• Maximum Input Frequency: 1000 MHz
• Maximum Power Dissipation: 2100 mW
• Maximum Operating Frequency: 250 MHz
• Maximum Power Gain: - 7 dB
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: TQFN-20 EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

expense of performance, contact the factory for details.
If the ±1% bias resistor values are not readily available,
substitute standard ±5% values.
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground-pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower-level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX2031 evaluation kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
18
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Layout Considerations
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
the capacitors shown in the Typical Application Circuit .
See Table 1.
The exposed pad (EP) of the MAX2031’s 20-pin thin
QFN-EP package provides a low-thermal-resistance
path to the die. It is important that the PC board on
which the MAX2031 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with
a low-inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PC board,
either directly or through an array of plated via holes.
Exposed Pad RF/Thermal Considerations
Power-Supply Bypassing
CC
pin with