SKY65227-11 Skyworks, SKY65227-11 Datasheet
SKY65227-11
Specifications of SKY65227-11
Available stocks
Related parts for SKY65227-11
SKY65227-11 Summary of contents
Page 1
DATA SHEET NEW R0g T0g PD0g PU0g PU1g PD1g T1g R1g Innovation BUY BUY NOW NOW Now available for purchase online. Rx0ag Tx0ag 2 GHz ...
Page 2
... DATA SHEET • SKY65227-11 Parameter Parameter Parameter Parameter Symbol Condition θ Symbol Condition Ω Symbol Condition Ω Symbol Condition Min. Typ. Max. Unit Min. Typ. Max. Unit Min. Typ. Max. Unit Min. Typ. Max. Unit ...
Page 3
... DATA SHEET • SKY65227-11 Parameter Mode V CC 802.11n Operation CAUTION: Although this device is designed robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be employed at all times. Ω ...
Page 4
... DATA SHEET • SKY65227-11 Parameter Parameter Parameter Symbol Condition ∆ Symbol Condition ∆ Symbol Condition Ω Ω Min. Typ. Max. Unit Ω Min. Typ. Max. Unit Ω Min. Typ. Max. Unit Ω ...
Page 5
... DATA SHEET • SKY65227-11 3.0 2.5 2.0 1.5 1.0 0.5 0 2380 2400 2420 2440 2460 Frequency (GHz) EVM vs. Frequency 2.4 2. Output Power (dBm) EVM vs. Output Power 2.4 2.45 0.95 0.85 0.75 0.65 0.55 0.45 0. Output Power (dBm) Detector Voltage vs. Output Power Ω ...
Page 6
... DATA SHEET • SKY65227- R0g 1 GND GND 4 T0g GND 7 49 GND GND T1g 10 GND GND 13 R1g Pin # GND 38 GND GND 35 GND 34 GND 33 GND 32 GND 31 GND 30 GND 29 GND GND 26 25 GND Pin Name Description EVB Label ...
Page 7
... DATA SHEET • SKY65227-11 Pin 1 Indicator Skyworks SKY65227-11 Lot # YYWWCC 10 ± 0.1 0.9 ± 0.1 Top View Pin 48 48x SMT Pad 2 1.275 4x 2.975 4x 4.675 20x 6.92 Bottom View 0.5 ± 0.075 (0.1) Metal 0.5 ± 0.03 Pad Edge Detail A Pad Scale: 2X 14X Rotated 180° ...
Page 8
... DATA SHEET • SKY65227-11 10.34 mm Pin 47 0.425 mm 24X 0.5 mm Pin 1 0.85 mm Typ. 0. 0.7 mm Thermal Via Array 0 0.7 mm Pitch 0.35mm Additional Vias in Common Ground Pad Will Improve Thermal Performance Thermal vias should be tented and filled with solder mask 30–35 µm copper plating recommended. ...
Page 9
... DATA SHEET • SKY65227-11 ...