89HPES24T6G2ZCAL Integrated Device Technology (Idt), 89HPES24T6G2ZCAL Datasheet - Page 17

• Manufacturer Part Number: 89HPES24T6G2ZCAL
• Description: PCI System Interconnect Switch 324-Pin FCBGA Tray
• Manufacturer: Integrated Device Technology (Idt)

Specifications of 89HPES24T6G2ZCAL

• Package: 324FCBGA
• Operating Temperature: 0 to 70 °C

IDT 89HPES24T6G2 Data Sheet
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 17. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 17), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
θ
Symbol
JA(effective)
θ
θ
P
JC
JB
θ
JA
= (T
J(max)
Effective Thermal Resistance, Junction-to-Ambient
θ
- T
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
J(max)
Table 18 Thermal Specifications for PES24T6G2, 27x27 mm FCBGA676 Package
Power Dissipation of the Device
)/P
, T
Parameter
A(max)
, and P are known, the value of desired
17 of 51
θ
CS
Value
14.6
4.31
), that of the heat sink (
8.2
7.2
3.1
0.3
θ
JA
Units
becomes a known entity to the system designer. How to
Watts
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
θ
JA
) for the worst case scenario must be
θ
SA
), amount of airflow, and properties of the
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
September 13, 2010
J(max)
θ
JC
(value
value