L717HDB44P Amphenol, L717HDB44P Datasheet - Page 133

• Manufacturer Part Number: L717HDB44P
• Description: Conn High Density D-Sub PIN 44 POS Solder Cup RA Thru-Hole 44 Terminal 1 Port
• Manufacturer: Amphenol
• Type: High Density D-Subr

Specifications of L717HDB44P

• Gender: PIN
• Termination Method: Solder Cup
• Mounting: Through Hole
• Body Orientation: Right Angle

Amphenol InfoCom Europe | www.amphenolinfocom.eu | [e-mail] | Specifications subject to change
QSFP
Amphenol QSFP copper cable assemblies are high performance,
cost effective interconnect solutions supporting Ethernet, Fiber
Channel, InfiniBand, SAS and SONET/SDH applications. QSFP
copper modules provide a high density, high bandwidth solution at
very low cost and reduced power budget. Amphenol’s high speed
cable assemblies meet and exceed industry standards for perfor-
mance and reliability.
Interface:
Cable Options:
Key Features:
Applications:
Complimentary
Products:
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38 position board- as connector
8-pair 26-30AWG
Amphenol Spectra-Strip SkewClear®
Amphenol Spectra-Strip SkewClear®EXD
Four channels transmit and receive
100Mb/s to 10Gb/s per channel capacity
Copper link length up to 20m
3x Port density over SFP
Precision process control for minimization of Pair- to-pair skew
Low crosstalk
Pull-to-release latch
Compliant to QSFP MSA
Fibre Channel
Infiniband, DDR, QDR
10/40Gb Ethernet
Switches, Routers and HBA’s
Enterprise Data Center
High Performance Computing(HPC) and Storage
QSFP limiting amplified copper Cables
QSFP short range optical modules
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