BAP63LX,315 NXP Semiconductors, BAP63LX,315 Datasheet
BAP63LX,315
Specifications of BAP63LX,315
BAP63LX T/R
BAP63LX T/R
Related parts for BAP63LX,315
BAP63LX,315 Summary of contents
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BAP63LX Silicon PIN diode Rev. 01 — 11 December 2007 1. Product profile 1.1 General description Planar PIN diode in a SOD882T leadless ultra small plastic SMD package. 1.2 Features I High speed switching for RF signals I Low diode ...
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... NXP Semiconductors 4. Marking Table 3. Type number BAP63LX 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg Thermal characteristics Table 5. Symbol R th(j-sp) 7. Characteristics Table 6. Characteristics unless otherwise specified. amb Symbol Parameter V forward voltage F I reverse current ...
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... NXP Semiconductors Table 6. Characteristics …continued unless otherwise specified. amb Symbol Parameter L insertion loss ins L insertion loss ins L insertion loss ins L insertion loss ins charge carrier life time L L series inductance S BAP63LX_1 Product data sheet Conditions see Figure 0.5 mA 900 MHz ...
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... NXP Semiconductors 400 C d (fF) 300 200 100 MHz Fig 1. Diode capacitance as a function of reverse voltage; typical values 0 ISL (dB 1000 amb Diode zero biased and inserted in series with a 50 stripline circuit Fig 3. Isolation of the diode as a function of frequency; typical values BAP63LX_1 Product data sheet ...
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... NXP Semiconductors 8. Package outline Leadless ultra small plastic package; 2 terminals; body 1 x 0 (1) DIMENSIONS (mm are the original dimensions UNIT max 0.40 0.55 0.65 mm 0.04 0.36 0.45 0.55 Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC SOD882T Fig 5. Package outline SOD882T ...
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... NXP Semiconductors 9. Abbreviations Table 7. Acronym PIN SMD RF 10. Revision history Table 8. Revision history Document ID Release date BAP63LX_1 20071211 BAP63LX_1 Product data sheet Abbreviations Description P-type, Intrinsic, N-type Surface Mounted Device Radio Frequency Data sheet status Product data sheet Rev. 01 — 11 December 2007 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Legal information 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 11.2 Defi ...