IRF3205ZSPBF International Rectifier, IRF3205ZSPBF Datasheet

MOSFET N-CH 55V 75A D2PAK

IRF3205ZSPBF

Manufacturer Part Number
IRF3205ZSPBF
Description
MOSFET N-CH 55V 75A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRF3205ZSPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
6.5 mOhm @ 66A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
75A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
110nC @ 10V
Input Capacitance (ciss) @ Vds
3450pF @ 25V
Power - Max
170W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Current, Drain
75 A
Gate Charge, Total
76 nC
Package Type
D2Pak
Polarization
N-Channel
Power Dissipation
170 W
Resistance, Drain To Source On
4.9 Milliohms
Temperature, Operating, Maximum
+175 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
45 ns
Time, Turn-on Delay
18 ns
Transconductance, Forward
71 S
Voltage, Breakdown, Drain To Source
55 V
Voltage, Forward, Diode
1.3 V
Voltage, Gate To Source
±20 V
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
6.5 m Ohms
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
110 A
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Fall Time
67 ns
Gate Charge Qg
76 nC
Minimum Operating Temperature
- 55 C
Rise Time
95 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRF3205ZSPBF
Description
This HEXFET
processing techniques to achieve extremely low
on-resistance per silicon area. Additional features
of this design are a 175°C junction operating
temperature, fast switching speed and improved
repetitive avalanche rating. These features combine
to make this design an extremely efficient and
reliable device for use in a wide variety of
applications.
Features
I
I
I
I
P
V
E
E
I
E
T
T
R
R
R
R
l
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
l
l
l
l
l
D
D
D
DM
AR
D
GS
AS (Thermally limited)
AS
AR
J
STG
θJC
θCS
θJA
θJA
@ T
@ T
@ T
@T
(Tested )
Lead-Free
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
C
C
C
C
= 25°C Continuous Drain Current, V
= 100°C Continuous Drain Current, V
= 25°C Continuous Drain Current, V
= 25°C Power Dissipation
®
Pulsed Drain Current
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Junction-to-Case
Case-to-Sink, Flat Greased Surface
Junction-to-Ambient
Junction-to-Ambient (PCB Mount)
Power MOSFET utilizes the latest
Ã
Parameter
Parameter
i
GS
GS
GS
g
@ 10V
@ 10V
@ 10V
d
j
i
i
(Silicon Limited)
(Package Limited)
IRF3205ZPbF
h
TO-220AB
G
See Fig.12a, 12b, 15, 16
Typ.
HEXFET
300 (1.6mm from case )
0.50
–––
–––
–––
IRF3205ZSPbF
10 lbf
D
S
-55 to + 175
D
y
2
Max.
in (1.1N
Pak
110
440
170
± 20
180
250
1.1
78
75
IRF3205ZSPbF
IRF3205ZLPbF
®
IRF3205ZPbF
R
Power MOSFET
DS(on)
y
V
m)
Max.
0.90
–––
DSS
I
62
40
D
IRF3205ZLPbF
= 75A
PD - 95129A
= 6.5mΩ
TO-262
= 55V
Units
Units
W/°C
°C/W
mJ
mJ
°C
W
A
V
A
1

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IRF3205ZSPBF Summary of contents

Page 1

... Parameter 95129A IRF3205ZPbF IRF3205ZSPbF IRF3205ZLPbF ® HEXFET Power MOSFET 55V DSS R = 6.5mΩ DS(on 75A Pak TO-262 IRF3205ZSPbF IRF3205ZLPbF Max. Units 110 440 170 W 1.1 W/°C ± 180 mJ 250 See Fig.12a, 12b 175 °C 300 (1.6mm from case ) lbf in (1.1N m) Typ ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V /∆T Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) gfs Forward Transconductance I Drain-to-Source Leakage Current DSS I Gate-to-Source Forward Leakage ...

Page 3

PULSE WIDTH Tj = 25° Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 1000 25°C 100 25V 20µs PULSE WIDTH 1 4.0 ...

Page 4

0V MHZ C iss = SHORTED C rss = C gd 5000 C oss = 4000 Ciss 3000 2000 1000 ...

Page 5

LIMITED BY PACKAGE 100 100 Case Temperature (°C) Fig 9. Maximum Drain Current Vs. Case Temperature 0.50 0.20 0.10 0.1 0.05 0.02 0.01 0.01 SINGLE ...

Page 6

D.U 20V V GS 0.01 Ω Fig 12a. Unclamped Inductive Test Circuit V (BR)DSS Fig 12b. Unclamped Inductive Waveforms ...

Page 7

Duty Cycle = Single Pulse 100 0.01 0.05 10 0.10 1 0.1 1.0E-08 1.0E-07 1.0E-06 Fig 15. Typical Avalanche Current Vs.Pulsewidth 200 TOP Single Pulse BOTTOM 10% Duty Cycle 66A 160 120 ...

Page 8

D.U.T + ƒ • • - • + ‚ -  • • • SD • Fig 17. Fig 18a. Switching Time Test Circuit V DS 90% 10 Fig 18b. Switching Time Waveforms 8 Driver Gate Drive P.W. ...

Page 9

EXAMPLE: T HIS IS AN IRF1010 LOT CODE 1789 AS S EMBLED ON WW 19, 2000 EMBLY LINE "C" Note: "P" embly line pos ition indicates "Lead - Free" TO-220AB package is ...

Page 10

T HIS IS AN IRF530S WIT H LOT CODE 8024 ASSE MB LED ON WW 02, 2000 IN THE AS SEMBLY LINE "L" OR Notes: 1. For an Automotive Qualified version of this part please see http://www.irf.com/product-info/auto/ 2. ...

Page 11

TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information EXAMPLE : T HIS IS AN IRL3103L LOT CODE 1789 AS SEMBLED ON WW 19, 1997 ASSEMBLY LINE "C" Note: "P" in assembly line ...

Page 12

D Pak Tape & Reel Infomation Dimensions are shown in millimeters (inches) TRR FEED DIRECTION 1.85 (.073) 1.65 (.065) TRL FEED DIRECTION 330.00 (14.173) MAX. NOTES : 1. COMFORMS TO EIA-418. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION MEASURED @ ...

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