FDC6304P Fairchild Semiconductor, FDC6304P Datasheet
FDC6304P
Manufacturer Part Number
FDC6304P
Description
MOSFET P-CH DUAL 25V SSOT-6
Manufacturer
Fairchild Semiconductor
Datasheet
1.FDC6304P.pdf
(5 pages)
Specifications of FDC6304P
Fet Type
2 P-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
1.1 Ohm @ 500mA, 4.5V
Drain To Source Voltage (vdss)
25V
Current - Continuous Drain (id) @ 25° C
460mA
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
1.5nC @ 4.5V
Input Capacitance (ciss) @ Vds
62pF @ 10V
Power - Max
700mW
Mounting Type
Surface Mount
Package / Case
6-SSOT, SuperSOT-6
Configuration
Dual
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
1.1 Ohm @ 4.5 V
Forward Transconductance Gfs (max / Min)
0.8 S
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
8 V
Continuous Drain Current
0.46 A
Power Dissipation
900 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDC6304P
FDC6304PTR
FDC6304PTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FDC6304P
Manufacturer:
FAIRCHILD
Quantity:
9 135
Part Number:
FDC6304P
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Mendoza, Joseph
E-mail: Joseph.Mendoza@notes.fairchildsemi.com
Phone: 63-32-400534
Implementation of change:
Expected 1st Device Shipment Date: 2007/11/24
Earliest Year/Work Week of Changed Product: D0744
Change Type Description: Die Attach Method
Description of Change (From): TiNiAg Backmetal and eutectic die attach process
Description of Change (To): TiNiAg backmetal and skip cure adhesive die attach process
Reason for Change : Process and Device improvement
Qual/REL Plan Numbers : Q20070126
Qualification :
Adhesive Die Attach and TiNiAg backmetal Qualification builds for SSOT-6L pass
assembly level and reliability stress test requirements. Adhesive Die Attach process
and TiNiAg backmetal is recommended for use on SSOT-6L package.
Results/Discussion
Test: (Autoclave)
Lot
Q20070126AAACLV
Q20070126ABACLV
Q20070126ACACLV
Test: (Power Cycle)
Lot
Q20070126AAPRCL
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Device
FDC6401N
Technical Contact:
Name: Mendoza, Joseph
E-mail: Joseph.Mendoza@notes.fairchildsemi.com
Phone: 63-32-400534
Device
FDC6401N
FDC6401N
FDC6401N
5000-CYCLES
0/77
96-HOURS
0/77
0/77
0/77
10000-CYCLES 15000-CYCLES Failure Code
0/77
Date Issued On : 2007/05/11
Date Created : 2007/03/30
Failure Code
PCN# : Q1071307
Pg. 1
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FDC6304P Summary of contents
Page 1
... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...
Page 2
... Results 0/308 0/308 0/308 FDC6301N FDC6302P_NL FDC6304P FDC6321C FDC634P_F073 FDC636P FDC638P_F073 FDC638P_NL FDC640P_F073 FDC640P_NL FDC642P_NB4N006 FDC654P FDC654P_NBGT007 FDC655BN FDC655BN_NL 0/77 0/77 0/77 1000 Failure Code 0/77 0/77 ...