ADP1111 PANASONIC EW, ADP1111 Datasheet - Page 4

• Manufacturer Part Number: ADP1111
• Description: ADP Pressure Sensor
• Manufacturer: PANASONIC EW

NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
1) Due to its small size, the thermal
capacity of the pressure sensor DIP type
is low. Therefore, take steps to minimize
the effects of external heat.
Dip soldering bath: Max. 260°C 500°F, 5
sec.
Soldering iron: 260 to 300°C
572°F
2) Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
4. Environment
Consult with us before using or storing
the pressure sensor chip in a place
exposed to corrosive gases (such as the
gases given off by organic solvents, sul-
fites, hydrogen sulfides, etc.) which will
adversely affect the performance of the
pressure sensor chip.
5. Quality check under actual loading
conditions
1) To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect
its performance.
2) As for test data, please contact us.
APPLICATION CIRCUIT
DIAGRAM (EXAMPLE)
The pressure sensor is designed to con-
vert a voltage by means of constant cur-
rent drive and then, if necessary, it
amplifies the voltage for use. The circuit
shown below is a typical example of a
circuit in which the pressure sensor is
used.
Constant current
circuit unit
(30W) within 5 sec.
Pressure
sensor
Amplifier circuit unit
OP
AMP
OP
AMP
500 to
OP
AMP
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in acci-
dents.
2) Air can be used directly as a pressure
medium. Consult with us before using a
corrosive gas (such as a gas given off by
an organic solvent, sulfite or hydrogen
sulfide) as the pressure medium.
3) The pressure sensor chip is posi-
tioned inside the pressure inlet. Never
poke wires or other foreign matter
through the pressure inlet since they
may damage the chip or block the inlet.
Avoid use when the atmospheric pres-
sure inlet is blocked.
4) Leave pin No. 4 unconnected since
the pressure sensor chip may be dam-
aged if a voltage is applied to this pin.
5) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
6) Since this pressure sensor chip does
not have a water-proof construction, con-
sult with us if it is to be used in a location
where it may be sprayed with water, etc.
7) Avoid using the pressure sensor chip
in an environment where condensation
may form. Furthermore, its output may
fluctuate if any moisture adhering to it
freezes.
MOUNTING METHOD
The general method for transmitting air
pressures differs depending on whether
the pressure is low or high.
• Checkpoints for use
<1> Select a pressure inlet pipe which is
<2> Fix the pressure inlet pipe securely
<3> Do not block the pressure inlet pipe.
sturdy enough to prevent pressure
leaks.
so as to prevent pressure leaks.
8) The pressure sensor chip is construct-
ed in such a way that its output will fluc-
tuate when it is exposed to light.
Especially when pressure is to be
applied by means of a transparent tube,
take steps to prevent the pressure sen-
sor chip from being exposed to light.
9) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
10) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
• When storing the pressure sensor
• When using the pressure sensor chips,
11) Due to the pressures involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
Methods of transmitting air pressures
chips, use a conductive material to
short the pins or wrap the entire chip in
aluminum foil. Plastic containers
should not be used to store or transport
the chips since they readily become
charged.
all the charged articles on the bench
surface and the work personnel should
be grounded so that any ambient static
will be safely discharged.
When the pressure
(4.9 to 98.1 kPa)
is low
Tube
If a tube is used as the pressure inlet pipe,
it may become disengaged. Therefore, use
a sturdy tube and secure it using O-rings.
Printed-
circuit
board
PF (ADP1)
When the pressure
(196.1 to 980.7 kPa)
is high
Printed-
circuit
board
O-ring
Pressure
inlet pipe