RB751V40T1G ON Semiconductor, RB751V40T1G Datasheet - Page 8

DIODE SCHOTTKY 1MA 40V SOD323

RB751V40T1G

Manufacturer Part Number
RB751V40T1G
Description
DIODE SCHOTTKY 1MA 40V SOD323
Manufacturer
ON Semiconductor
Datasheet

Specifications of RB751V40T1G

Voltage - Forward (vf) (max) @ If
370mV @ 1mA
Voltage - Dc Reverse (vr) (max)
30V
Current - Average Rectified (io)
30mA (DC)
Current - Reverse Leakage @ Vr
500nA @ 30V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Capacitance @ Vr, F
2.5pF @ 1V, 1MHz
Mounting Type
Surface Mount
Package / Case
SC-76, SOD-323, UMD2
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
0.03 A
Max Surge Current
0.5 A
Configuration
Single
Forward Voltage Drop
0.37 V @ 0.001 A
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
- 55 C to + 150 C
Mounting Style
SMD/SMT
Rectifier Type
Schottky Diode
Peak Rep Rev Volt
40V
Avg. Forward Curr (max)
0.03A
Rev Curr
0.5uA
Peak Non-repetitive Surge Current (max)
0.5A
Forward Voltage
0.37V
Operating Temp Range
-55C to 150C
Package Type
SOD-323
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
RB751V40T1GOS
RB751V40T1GOS
RB751V40T1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
RB751V40T1G
Manufacturer:
ON
Quantity:
9 000
Part Number:
RB751V40T1G
Manufacturer:
ON
Quantity:
30 000
Company:
Part Number:
RB751V40T1G
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100
Company:
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Final Product/Process Change Notification #16266
SC88 and SC88A
MSQA6V1W5T2G
Test:
Precondition
Autoclave+PC Ta=121C RH=100% ~15 psig
TC+PC Ta= -65 C to 150 C
HTSL
DPA Per AECQ101, after 1000 cyc TC
RSH
ELECTRICAL CHARACTERIZATION PLAN:
Datasheet specifications and product electrical performance will remain unchanged
Characterization of each qual vehicle device will be performed to the following requirements:
ELECTRICAL CHARACTERIZATION RESULTS:
Available upon request
CHANGED PART IDENTIFICATION:
Products assembled with the Copper Wire from the ON Semiconductor facility will have a Finish
Good Date Code representing Work Week 35, 2009 (date code 9) or newer.
Issue Date: 08 Jun 2009
1) Three temperature characterization on 30 units from 3 lots
2) ESD performance ( HBM, MM) on 15 units from 1 lot
MSL1@ 260C , 3 X IR at 260 C/260 C
Ta=150C
Ta=260C, 10 sec dwell
Conditions:
Rev.14 Jun 2007
Interval:
1000 cyc
1008 hrs
96 hrs
Results
0/480
0/240
0/240
0/240
0/6
0/90
Page 8 of 36

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