BAL74,215 NXP Semiconductors, BAL74,215 Datasheet - Page 3

DIODE HI SPEED SW 50V SOT-23

BAL74,215

Manufacturer Part Number
BAL74,215
Description
DIODE HI SPEED SW 50V SOT-23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAL74,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
50V
Current - Average Rectified (io)
215mA (DC)
Current - Reverse Leakage @ Vr
100nA @ 50V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
2pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
50 V
Forward Continuous Current
0.215 A
Max Surge Current
4 A
Configuration
Single
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.1 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3424-2
934002810215
BAL74 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAL74,215
Manufacturer:
NXP
Quantity:
10
Part Number:
BAL74,215
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Device mounted on an FR4 printed-circuit board.
ELECTRICAL CHARACTERISTICS
T
THERMAL CHARACTERISTICS
Note
1. Device mounted on an FR4 printed-circuit board.
2003 Dec 17
V
V
I
I
I
P
T
T
V
I
C
t
V
R
R
SYMBOL
SYMBOL
SYMBOL
j
F
FRM
FSM
R
rr
stg
j
RRM
R
tot
= 25 °C unless otherwise specified.
F
fr
High-speed diode
d
th(j-tp)
th(j-a)
repetitive peak reverse voltage
continuous reverse voltage
continuous forward current
repetitive peak forward current
non-repetitive peak forward current square wave; T
total power dissipation
storage temperature
junction temperature
forward voltage
reverse current
diode capacitance
reverse recovery time
forward recovery voltage
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
PARAMETER
PARAMETER
PARAMETER
see Fig.2; note 1
see Fig.4
T
see Fig.3
see Fig.5
f = 1 MHz; V
when switched from I
R
when switched from I
amb
L
t
t
t
I
I
I
I
V
V
p
p
p
F
F
F
F
= 100 Ω; measured at I
R
R
= 1 µs
= 1 ms
= 1 s
= 1 mA
= 10 mA
= 50 mA
= 150 mA
= 25 °C; note 1
= 50 V
= 50 V; T
note 1
3
R
= 0; see Fig.6
j
j
CONDITIONS
= 150 °C
= 25 °C prior to surge;
CONDITIONS
CONDITIONS
F
F
= 10 mA to I
= 10 mA; t
R
= 1 mA; see Fig.7
r
= 20 ns; see Fig.8 1.75
R
= 10 mA;
−65
MIN. MAX. UNIT
VALUE
Product data sheet
330
500
715
855
1
1.25
0.1
100
2
4
MAX. UNIT
50
50
215
500
4
1
0.5
250
+150
150
BAL74
UNIT
K/W
K/W
mV
mV
V
V
µA
µA
pF
ns
V
V
V
mA
mA
A
A
A
mW
°C
°C

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