BAV23CLT1G ON Semiconductor, BAV23CLT1G Datasheet
BAV23CLT1G
Specifications of BAV23CLT1G
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BAV23CLT1G Summary of contents
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... Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping BAV23CLT1G SOT−23 3000/Tape & Reel (Pb−Free) including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: BAV23CLT1/D † ...
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THERMAL CHARACTERISTICS Characteristic SINGLE HEATED Total Device Dissipation (Note 25°C A Derate above 25°C Thermal Resistance, Junction−to−Ambient (Note 1) Thermal Reference, Junction−to−Anode Lead (Note 1) Thermal Reference, Junction−to−Case (Note 1) Total Device Dissipation (Note ...
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V , FORWARD VOLTAGE (V) F Figure 1. Forward Voltage 3.0 2.5 2.0 1.5 1.0 0 820 W + 100 mH F 0.1 mF D.U.T. ...
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... SCALE 10:1 0.8 0.031 N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 Y14.5M, 1982. FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL ...