BAS40XY,115 NXP Semiconductors, BAS40XY,115 Datasheet - Page 14

DIODE SCHOTTKY 40V 120MA 6-UMT

BAS40XY,115

Manufacturer Part Number
BAS40XY,115
Description
DIODE SCHOTTKY 40V 120MA 6-UMT
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS40XY,115

Package / Case
SC-70-6, SC-88, SOT-363
Voltage - Forward (vf) (max) @ If
1V @ 40mA
Current - Reverse Leakage @ Vr
10µA @ 40V
Current - Average Rectified (io) (per Diode)
120mA (DC)
Voltage - Dc Reverse (vr) (max)
40V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
2 Pair Series Connection
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
0.12 A
Max Surge Current
0.2 A
Configuration
Double Dual Series
Forward Voltage Drop
1 V @ 0.04 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
934059955115
BAS40XY T/R
BAS40XY T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS40XY,115
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 20. Reflow soldering footprint SOD123F
Fig 21. Reflow soldering footprint SOD882
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.6
R = 0.05 (8×)
solder lands
solder resist
occupied area
solder paste
BAS40 series; 1PSxxSB4x series
(2×)
1.1
Rev. 08 — 13 January 2010
0.90
4.4
2.9
1.6
4
0.30
0.40
0.50
(2×)
(2×)
(2×)
0.30
1.30
1.1 1.2
General-purpose Schottky diodes
R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
mbl872
0.80
(2×)
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