LT3466EFE Linear Technology, LT3466EFE Datasheet - Page 19

no-image

LT3466EFE

Manufacturer Part Number
LT3466EFE
Description
IC,Laser Diode/LED Driver,TSSOP,16PIN,PLASTIC
Manufacturer
Linear Technology
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LT3466EFE
Manufacturer:
LT
Quantity:
5 000
Part Number:
LT3466EFE
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LT3466EFE#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LT3466EFE#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
PACKAGE DESCRIPTIO
3.50 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
0.25 ± 0.05
1.65 ±0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(2 SIDES)
6.60 ±0.10
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
(.0035 – .0079)
0.09 – 0.20
4.50 ±0.10
2.38 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50
BSC
(.169 – .177)
SEE NOTE 4
4.30 – 4.50*
(.020 – .030)
U
0.50 – 0.75
(.141)
MILLIMETERS
3.58
0.65 BSC
(INCHES)
0.675 ±0.05
PACKAGE
OUTLINE
0.45 ±0.05
10-Lead Plastic DFN (3mm × 3mm)
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1699)
(Reference LTC DWG # 05-08-1663)
(.116)
2.94
1.05 ±0.10
Exposed Pad Variation BB
(SEE NOTE 6)
0.25
REF
TOP MARK
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FOR EXPOSED PAD ATTACHMENT
0° – 8°
DD Package
FE Package
PIN 1
0.200 REF
(.0256)
0.65
BSC
16 1514 13 12 11
1
(.0077 – .0118)
0.195 – 0.30
2
TYP
(.193 – .201)
3 4 5 6 7 8
4.90 – 5.10*
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
(.141)
3.58
0.00 – 0.05
10
1.65 ± 0.10
(2 SIDES)
9
(.002 – .006)
0.05 – 0.15
FE16 (BB) TSSOP 0204
(.0433)
(.116)
2.94
MAX
1.10
BOTTOM VIEW—EXPOSED PAD
(.252)
6.40
BSC
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
LT3466
(DD10) DFN 1103
19
3466fa

Related parts for LT3466EFE