BAT54CV,115 NXP Semiconductors, BAT54CV,115 Datasheet

DIODE SCHOTTKY 30V 200MA SOT666

BAT54CV,115

Manufacturer Part Number
BAT54CV,115
Description
DIODE SCHOTTKY 30V 200MA SOT666
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAT54CV,115

Package / Case
SS Mini-6 (SOT-666)
Voltage - Forward (vf) (max) @ If
800mV @ 100mA
Current - Reverse Leakage @ Vr
2µA @ 25V
Current - Average Rectified (io) (per Diode)
200mA (DC)
Voltage - Dc Reverse (vr) (max)
30V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Common Cathode
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
200 mA
Max Surge Current
2 A
Configuration
Dual
Forward Voltage Drop
240 mV
Maximum Reverse Leakage Current
2 uA
Maximum Power Dissipation
440 mW
Operating Temperature Range
+ 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3414-2
934058073115
BAT54CV T/R
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Two planar Schottky barrier double diodes with common cathodes and an integrated
guard ring for stress protection encapsulated in a SOT666 ultra small and flat lead
Surface-Mounted Device (SMD) plastic package.
Table 1.
[1]
Symbol
Per diode
I
V
V
F
R
F
BAT54CV
Two Schottky barrier double diodes
Rev. 3 — 15 November 2010
Low forward voltage
Low capacitance
AEC-Q101 qualified
Ultra small and flat lead SMD plastic package
Excellent coplanarity and improved thermal behavior
Ultra high-speed switching
Voltage clamping
Line termination
Reverse polarity protection
Pulse test: t
Quick reference data
Parameter
forward current
reverse voltage
forward voltage
p
≤ 300 μs; δ ≤ 0.02.
Conditions
I
I
I
I
I
F
F
F
F
F
= 0.1 mA
= 1 mA
= 10 mA
= 30 mA
= 100 mA
[1]
Min
-
-
-
-
-
-
-
Typ
-
-
-
-
-
-
-
Product data sheet
Max
200
30
240
320
400
500
800
mA
V
Unit
mV
mV
mV
mV
mV

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BAT54CV,115 Summary of contents

Page 1

BAT54CV Two Schottky barrier double diodes Rev. 3 — 15 November 2010 1. Product profile 1.1 General description Two planar Schottky barrier double diodes with common cathodes and an integrated guard ring for stress protection encapsulated in a SOT666 ultra ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package BAT54CV 4. Marking Table 4. Type number BAT54CV 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode FRM I FSM BAT54CV Product data sheet Pinning ...

Page 3

... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device, one diode loaded P tot amb T stg = 25 °C prior to surge. [ [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...

Page 4

... NXP Semiconductors 7. Characteristics Table amb Symbol Per diode [1] Pulse test (mA (1) (2) (3) 1 − 0.4 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values BAT54CV Product data sheet Characteristics ° C unless otherwise specified. ...

Page 5

... NXP Semiconductors = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. ...

Page 6

... NXP Semiconductors 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BAT54CV [1] For further information and the availability of packing methods, see 11. Soldering 2 1.7 Fig 5. BAT54CV Product data sheet Packing methods Package Description SOT666 4 mm pitch tape and reel 2 ...

Page 7

... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date BAT54CV v.3 20101115 • Modifications: Section 1.2 “Features and • Table 1 “Quick reference • Table 5 “Limiting • Table 6 “Thermal • Figure • Section 8 “Test • Section 11 • Section 13 “Legal BAT54CV_2 20100115 ...

Page 8

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 9

... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...

Page 10

... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Packing information ...

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