VS6650S02F/T2 STMicroelectronics, VS6650S02F/T2 Datasheet

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VS6650S02F/T2

Manufacturer Part Number
VS6650S02F/T2
Description
MODULE CAMERA SMIA 1MP W/LENS
Manufacturer
STMicroelectronics
Type
CMOS Imagingr
Datasheet

Specifications of VS6650S02F/T2

Pixel Size
4µm x 4µm
Active Pixel Array
1152H x 864V
Frames Per Second
30
Voltage - Supply
2.4 V ~ 2.9 V
Package / Case
SMOP2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-3894-1
FEATURES
DESCRIPTION
The VS6650 is a 1.0 Megapixel camera module for
use across a range of mobile phone platforms.
The camera module, which is SMIA 1.0 profile 1
compliant, can generate 1.0 Megapixel images up
to 30 fps.
Based on the SMIA architectural concepts, the
VS6650 can be used with or without image pro-
cessor (i.e. STV0976 or STV0984). The module is
suitable for performance-driven camera phones
and cost-driven high volume designs. The embed-
ded horizontal scaler typically enables the realiza-
tion of power-efficient viewfinder that uses host
software processing. For performance driven ap-
plications or when a different video interface is re-
quired, the STV0976 mobile imaging processor
ensures state-of-the-art image reconstruction and
compression at up to 15 fps.
October 2004
1.0 Megapixel resolution (1152H x 864V)
SMIA
CCP 2.0 serial video interface
Two-wire control port (CCI)
On-chip PLL based on 13 MHz system clock
Up to 30 frame per second (fps) progressive
scan, with smooth frame rate control
Horizontal downscale from 1x to 4.5x in 1/16
steps
Operation from 2.4 V analog power supply
Low EMI 1.8 V digital and I/O power supply
30 µW power-down consumption
10-bit on-chip ADC
Small size 1/3 inch lens fixed focus module
Integral EMC shielding
1
1.0 profile 1 compliant imager
1.Standard Mobile Imaging Architecture, visit
www.smia-forum.org
1.0 Megapixel SMIA Camera Module
The VS6650 features allow straightforward inte-
gration into mobile phone designs: low EMI video
interface and package/socket shielding, low wire
count (8 total), embedded power management (30
µW power-down) and embedded PLL. A minimal
list of external components is required: supply de-
coupling capacitors, CCI pull-ups and a charge-
pump capacitor.
The VS6650 3-element lens design ensures high
quality image capture while maintaining low mod-
ule height. The overall optical stack, including lens
system, IR filter and sensor optical structures is
developed within ST.
The VS6650 package uses the second generation
of SmOP2 packaging technology. Sensor and lens
are assembled in a fully automated test and focus
process for high volume and low cost production.
This 1.0 Megapixel sensor fits within the SMIA95
form factor (9.5 x 9.5 x 7.6 mm
APPLICATIONS
Table 1. Order Codes
VS6650S02F/T2
Mobile phone
PDA
Wireless security camera
Part Number
SmOP2 SMIA95 22” tape and reel
Description
3
).
VS6650
Rev. 1
DATA BRIEF
1/3

Related parts for VS6650S02F/T2

VS6650S02F/T2 Summary of contents

Page 1

... This 1.0 Megapixel sensor fits within the SMIA95 form factor (9.5 x 9.5 x 7.6 mm APPLICATIONS Mobile phone ■ PDA ■ Wireless security camera ■ Table 1. Order Codes Part Number VS6650S02F/T2 VS6650 DATA BRIEF 3 ). Description SmOP2 SMIA95 22” tape and reel Rev. 1 1/3 ...

Page 2

VS6650 Figure 1. Application Diagram EXTCLK STV0976 VS6650 XSHUTDOWN 1.0 Megapixel 1.0 Megapixel SMIA SMIA Camera Mobile CCI Module Imaging Processor (optional) CCP 2.0 Figure 2. Block Diagram VS6650 PLL and Clock Management EXTCLK Power Mgmt Power-On Reset XSHUTDOWN Sensor ...

Page 3

... No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics ...

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