CY8C3245AXI-158 Cypress Semiconductor Corp, CY8C3245AXI-158 Datasheet - Page 111

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CY8C3245AXI-158

Manufacturer Part Number
CY8C3245AXI-158
Description
CY8C3245AXI-158
Manufacturer
Cypress Semiconductor Corp
Series
PSOC™ 3 CY8C32xxr

Specifications of CY8C3245AXI-158

Core Processor
8051
Core Size
8-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, LIN, SPI, UART/USART
Peripherals
CapSense, DMA, POR, PWM, WDT
Number Of I /o
62
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 5.5 V
Data Converters
A/D 2x12b, D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Technology
CMOS
Processing Unit
Microcontroller
Operating Supply Voltage (min)
1.8V
Operating Supply Voltage (typ)
2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Package Type
TQFP
Screening Level
Industrial
Pin Count
100
Mounting
Surface Mount
Rad Hardened
No
Processor Series
CY8C32
Core
8051
Data Bus Width
32 bit
Data Ram Size
4 KB
Interface Type
I2C, SPI, UART, USB
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
1.71 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Controller Family/series
(8051) PSOC 3
No. Of I/o's
62
Eeprom Memory Size
1KB
Ram Memory Size
4KB
Cpu Speed
50MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY8C3245AXI-158
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY8C3245AXI-158
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY8C3245AXI-158
Quantity:
4
Document Number: 001-56955 Rev. *J
LASER MARK
PIN 1 DOT
1.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.17g
4. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1
7
1
HATCH AREA IS SOLDERABLE EXPOSED METAL.
1
8
6
8
Figure 13-3. 68-pin QFN 8×8 with 0.4 mm Pitch Package Outline (Sawn Version)
8.000±0.100
TOP VIEW
Figure 13-4. 100-pin TQFP (14 × 14 × 1.4 mm) Package Outline
5
2
3
4
5
1
3
5
0.900±0.100
SIDE VIEW
0.200 REF
0.05 MAX
5.7±0.10
0.400±0.100
0.20±0.05
5
1
3
5
PSoC
5
2
3
4
SOLDERABLE
EXPOSED
BOTTOM VIEW
®
6.40 REF
0.400 PITCH
PAD
5.7±0.10
3: CY8C32 Family
Data Sheet
6
8
1
8
51-85048 *E
001-09618 *C
Page 111 of 119
1
7
1
PIN1 ID
R 0.20
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