AM29LV033C-70EI AMD (ADVANCED MICRO DEVICES), AM29LV033C-70EI Datasheet - Page 7

• Manufacturer Part Number: AM29LV033C-70EI
• Description: IC 32MEG (4M X 8-BIT) 3V SCTR
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

CONNECTION DIAGRAMS
Special Handling Instructions for FBGA
Packages
Special handling is required for Flash Memor y
products in FBGA packages.
6
NC*
NC*
NC*
NC*
A8
A7
A1
A2
NC*
NC*
NC*
B8
B7
B1
RY/BY#
WE#
A14
C7
C6
C4
C2
C5
C3
A9
A7
A3
* Balls are shorted together via the substrate but not connected to the die.
RESET#
ACC
A13
A18
D7
D6
D4
D2
D5
D3
A8
A4
63-Ball FBGA (Top View, Balls Down)
A15
A11
E7
E6
NC
E4
NC
E2
E5
E3
A6
A2
Am29LV033C
A16
A12
NC
NC
F7
F6
F4
A5
F2
A1
F5
F3
DQ5
DQ2
DQ0
A17
A19
G7
G6
G4
G2
G5
G3
A0
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150 C for prolonged periods of time.
DQ3
CE#
A10
H7
H6
H4
H2
NC
NC
NC
H5
H3
DQ6
OE#
V
V
A20
NC
J7
J6
J4
J2
J5
J3
CC
CC
DQ7
DQ4
DQ1
V
A21
V
K7
K6
K4
K2
K5
K3
SS
SS
NC*
NC*
NC*
NC*
L8
L7
L1
L2
NC*
NC*
NC*
NC*
M8
M7
M1
M2