ADSP-TS101SAB1-100 Analog Devices Inc, ADSP-TS101SAB1-100 Datasheet - Page 44

• Manufacturer Part Number: ADSP-TS101SAB1-100
• Description: IC,DSP,32-BIT,BGA,625PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: TigerSHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-TS101SAB1-100

• Rohs Status: RoHS non-compliant
• Interface: Host Interface, Link Port, Multi-Processor
• Clock Rate: 300MHz
• Non-volatile Memory: External
• On-chip Ram: 768kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 625-BGA
• Other names: ADSP-TS101SAB1100

ADSP-TS101S
SURFACE-MOUNT DESIGN
The following table is provided as an aide to PCB design.
For industry-standard design recommendations, refer to
IPC-7351, Generic Requirements for Surface-Mount Design
and Land Pattern Standard.
Package
625-ball (27 mm) PBGA
484-ball (19 mm) PBGA
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.25 mm OF ITS
3. CENTER DIMENSIONS ARE NOMINAL.
4. THIS PACKAGE COMPLIES WITH THE JEDEC MS-034 SPECIFICATION,
2.50 MAX
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
BUT USES TIGHTER TOLERANCES THAN THE MAXIMUMS ALLOWED IN
THAT SPECIFICATION.
24.20
24.00
23.80
Ball Attach Type
Solder Mask Defined (SMD)
Solder Mask Defined (SMD)
TOP VIEW
24.20
24.00
23.80
27.20
27.00
26.80
Rev. C | Page 44 of 48 | May 2009
Figure 44. 625-Ball PBGA (B-625)
27.20
27.00
26.80
DETAIL A
Solder Mask Opening
0.45 mm diameter
0.40 mm diameter
24.00
BSC
SQ
SEATING PLANE
BSC
1.50
SQ
PITCH
BALL
BSC
BSC
1.00
1.50
SQ
SQ
BALL DIAMETER
0.65
0.55
0.45
25
24 22
23
21 19
20
18
17
BOTTOM VIEW
16
DETAIL A
15
Ball Pad Size
0.60 mm diameter
0.53 mm diameter
14
27.20
27.00 SQ
26.80
13
12
11
10
0.70
0.60
0.50
9
8
7
6
5
4
1.25 MAX
0.40 MIN
0.20 MAX
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE