TGP1439 TriQuint, TGP1439 Datasheet - Page 5

• Manufacturer Part Number: TGP1439
• Description: Wireless Accessories 18-20GHz 5 Bit Phase Shifter
• Manufacturer: TriQuint

Specifications of TGP1439

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1008500

Reflow process assembly notes:
Component placement and adhesive attachment assembly notes:
Interconnect process assembly notes:
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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thermosonic ball bonding is the preferred interconnect technique
force, time, and ultrasonics are critical parameters
aluminum wire should not be used
discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire
maximum stage temperature: 200ΓC
AuSn (80/20) solder with limited exposure to temperatures at or above 300ΓC
alloy station or conveyor furnace with reducing atmosphere
no fluxes should be utilized
coefficient of thermal expansion matching is critical for long-term reliability
storage in dry nitrogen atmosphere
vacuum pencils and/or vacuum collets preferred method of pick up
avoidance of air bridges during placement
force impact critical during auto placement
organic attachment can be used in low-power applications
curing should be done in a convection oven; proper exhaust is a safety concern
microwave or radiant curing should not be used because of differential heating
coefficient of thermal expansion matching is critical
TriQuint Semiconductor Texas : [phone]
Recommend 500 Ω Ω Ω Ω
series resistance
on the control lines
Chip Assembly and Bonding Diagram
Advance Product Information
Fax [phone] Web: www.triquint.com
TGP1439-EPU
June 29, 2001
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