TGA8061-SCC TriQuint, TGA8061-SCC Datasheet - Page 8

• Manufacturer Part Number: TGA8061-SCC
• Description: Wireless Accessories 0.1-3.5GHz LNA Self Biased
• Manufacturer: TriQuint

Specifications of TGA8061-SCC

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1004355

Units: Millimeters (inches)
Thickness: 0.01016 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/-0.058 (0.002)
Bond pad #1 (RF Input):
Bond pad #2 (Vs1):
Bond pad #3 (R1):
Bond pad #4 (R2):
Bond pad #5 (R4):
Bond pad #6 (R3):
Bond pad #7 (V+):
Bond pad #8 (Vadj):
Bond pad #9 (RF Output):
Test point (pad) #10 (Vd1):
0.1549 x 0.1829 (0.0061 x 0.0072)
radius 0.0864 (0.0034) (half circle)
0.1270 x 0.2540 (0.0050 x 0.0100)
0.2616 x 0.6604 (0.0103 x 0.0260)
0.1118 x 0.1118 (0.0044 x 0.0044)
0.1219 x 0.1143 (0.0048 x 0.0045)
0.1219 x 0.1118 (0.0048 x 0.0044)
0.1219 x 0.1118 (0.0048 x 0.0044)
0.4064 x 0.1219 (0.0160 x 0.0048)
0.1219 x 0.1219 (0.0048 x 0.0048)