430759-512 Laird Technologies, 430759-512 Datasheet

PELTIER UT11,12,F2,3030,TA,RT,W6

430759-512

Manufacturer Part Number
430759-512
Description
PELTIER UT11,12,F2,3030,TA,RT,W6
Manufacturer
Laird Technologies
Type
Ceramic Plater
Datasheet

Specifications of 430759-512

Cooling Power
104.8 W
Max Heat Load
+ 75 C
Maximum Current
11.1 A
Maximum Voltage
16.4 V
Height
0.095 mm
Length
34 mm
Width
30 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
926-1286
Innovative Technology
global
Americas: +1 888.246.9050
Europe: +46.31.704.67.57
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
for a Connected World
solutions:
local
support
TM
The UltraTEC
assembled with a large number of semiconductor couples to achieve a higher heat pumping capacity
than standard single stage TEMs.
This product line is available in multiple configurations and is ideal for applications that require higher
cooling capacities with limited surface area. Assembled with Bismuth Telluride semiconductor material
and thermally conductive Aluminum Oxide ceramics, the UltraTEC
current and larger heat-pumping applications.
FEaTUrES
• High heat pump density
• Precise temperature control
• Reliable solid state operation
• No sound or vibration
• DC operation
• RoHS compliant
SEaling opTion
UltraTEC
SuffIx ThIckneSS
Ta
TB
SuffIx
rT
eP
Performance SPecIfIcaTIonS
Hot side temperature (°C)
Qmax (watts)
Delta Tmax (°C)
Imax (amps)
Vmax (volts)
Module resistance (ohms)
0.095” +/- 0.001”
0.095” +/- 0.0005”
SealanT
rTV
Epoxy
Tm
Series is a high heat pumping density thermoelectric module (TEM). The module is
color
White
Black
TM
Series UT11,12,F2,3030
flaTneSS &
ParallelISm
0.001” / 0.001”
0.0005” / 0.0005” lapped
TemP range
-60 to 204 °C
-55 to 150 °C
25
95.4
67
11.1
14.5
1.20
Thermoelectric Module
appliCaTionS
• Analytical instrumentation
• Clinical diagnostics
• Photonics laser systems
• Electronic enclosure cooling
• Food and beverage cooling
• Chillers (liquid cooling)
50
104.8
75
11.1
16.4
1.36
deScrIPTIon
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
hoT face cold face lead lengTh
lapped
Tm
Series is designed for higher
lapped
lapped
6.0”
6.0”

Related parts for 430759-512

430759-512 Summary of contents

Page 1

Innovative Technology for a Connected World global solutions: local support TM Americas: +1 888.246.9050 Europe: +46.31.704.67.57 Asia: +86.755.2714.1166 clv.customerpos@lairdtech.com www.lairdtech.com UltraTEC Series UT11,12,F2,3030 TM The UltraTEC Tm Series is a high heat pumping density thermoelectric module (TEM). The module is assembled with a large number of semiconductor couples to achieve a higher heat pumping capacity than standard single stage TEMs. This product line is available in multiple configurations and is ideal for applications that require higher cooling capacities with limited surface area. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the UltraTEC current and larger heat-pumping applications. FEaTUrES • High heat pump density • Precise temperature control • Reliable solid state operation ...

Page 2

... Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc ...

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