ECLAMP2410P.TCT Semtech, ECLAMP2410P.TCT Datasheet - Page 5

• Manufacturer Part Number: ECLAMP2410P.TCT
• Manufacturer: Semtech

Specifications of ECLAMP2410P.TCT

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -40C to 85C
• Product Height (mm): 0.65mm
• Product Depth (mm): 1.7mm
• Lead Free Status / RoHS Status: Compliant

Device Connection
The EClamp2410P is a microSD/T-Flash interface device
designed for use in cell phones and other portable
electronic devices. The EClamp2410P is comprised of
series and pull up resistors required on the microSD
interface. Each line also includes TVS diodes for ESD
protection. The device may be confi gured for SD or SPI
mode operation. In SD mode for example, the 15k Ohm
pull up resistors (Rup 1 and Rup 3) are connected to
VDD. In SPI mode pin 4 is not connected (Rup 1) since
these are reserved lines. The 50k Ohm pull up resistor
is used for card detection or SPI mode selection during
power up and is disconnected by the user during regular
data transfer.
The EClamp2410P is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the bottom
of the device. The device has a fl ow through design for
easy layout. Pin connections are noted in Figure 1. A
center tab serves as the ground connection. Recom-
mendations for the ground connection are given below.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the fi ltering and ESD performance of the device.
Ground loop inductance can be reduced by using mul-
tiple vias to make the connection to the ground plane.
Figure 2 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller di-
ameter (such as 0.005 inches or 0.125mm) since chang-
ing the diameter of the via will result in little change in
inductance.
Layout Guidelines for Optimum ESD Protection
Good circuit board layout is critical not only for signal
integrity, but also for effective suppression of ESD
induced transients. For optimum ESD protection, the
following guidelines are recommended:
 2006 Semtech Corp.
PROTECTION PRODUCTS
Applications Information
Place the device as close to the connector as
possible. This practice restricts ESD coupling into
adjacent traces and reduces parasitic inductance.
The ESD transient return path to ground should be
kept as short as possible. Whenever possible, use
multiple micro vias connected directly from the
device ground pad to the ground plane.
Avoid running critical signals near board edges.
5
Figure 2 - Recommended Layout using Ground Vias
Figure 1 - Pin Identifi cation and Confi guration
D AT1 In
D AT0 In
D AT3 In
D AT2 In
C MD In
C L K In
R u p 1
Vd d
(Top Side View)
1
EClamp2410P
1 6
D AT1 O u t
D AT0 O u t
C L K O u t
R u p 3
R u p 2
C MD O u t
D AT3 O u t
D AT2 O u t
PRELIMINARY
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