HSDL-3020-021 Lite-On Electronics, HSDL-3020-021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3020-021
• Description: Infrared Transceivers IR Transceiver 4.0Mb/s
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3020-021

• Wavelength: 875 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 10 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 190 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 10.4 mm x 2.95 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Reflow Profile
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective re-
flow solder process. The temperature profile is di-
vided into four process zones, each with different
DT/Dtime temperature change rates. The DT/Dtime rates
are detailed in the above table. The temperatures are
measured at the component to printed circuit board
connections.
In process zone P1, the PC board and HSDL-3020 castella-
tion pins are heated to a temperature of 160°C to acti-
vate the flux in the solder paste. The temperature ramp
up rate, R1, is limited to 4°C per second to allow for even
heating of both the PC board and HSDL-3020 castella-
tions.
Process zone P2 should be of sufficient time duration (60 to
120 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the
solder, usually 200°C (392°F).
12
255
230
220
200
180
160
120
80
25
0
HEAT
R1
UP
P1
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
50
SOLDER PASTE DRY
R2
P2
100
t-TIME (SECONDS)
DT
25°C to 160°C
160°C to 200°C
200°C to 255°C (260°C at 10 seconds max)
255°C to 200°C
200°C to 25°C
150
R3
MAX. 260°C
REFLOW
SOLDER
60 sec.
ABOVE
MAX.
220°C
P3
200
R4
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point
of solder to 255°C (491°F) for optimum results. The
dwell time above the liquidus point of solder should
be between 20 and 60 seconds. It usually takes about
20 seconds to assure proper coalescing of the solder
balls into liquid solder and the formation of good sol-
der connections. Beyond a dwell time of 60 seconds, the
intermetallic growth within the solder connections be-
comes excessive, resulting in the formation of weak and
unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the
solder, usually 200°C (392°F), to allow the solder within
the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the sol-
der to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and HSDL-3020 castellations to change dimen-
sions evenly, putting minimal stresses on the HSDL-3020
transceiver.
DOWN
COOL
P4
R5
250
300
Maximum DT/Dtime
4°C/s
0.5°C/s
4°C/s
-6°C/s
-6°C/s