ADIS16362/PCBZ Analog Devices Inc, ADIS16362/PCBZ Datasheet - Page 2

• Manufacturer Part Number: ADIS16362/PCBZ
• Description: Inertial Sensor Interface Board
• Manufacturer: Analog Devices Inc
• Series: iMEMS®, iSensor™r

Specifications of ADIS16362/PCBZ

• Silicon Manufacturer: Analog Devices
• Application Sub Type: Accelerometer / Gyroscope
• Kit Application Type: Sensing - Motion / Vibration / Shock
• Silicon Core Number: ADIS16362
• Kit Contents: Board
• Sensor Type: Accelerometer, Gyroscope, 3 Axis
• Sensing Range: ±1.7g, ±75°/sec, ±150°/sec, ±300°/sec
• Sensitivity: 0.333mg/LSB, 0.0125 ~ 0.05°/sec/LSB
• Voltage - Supply: 4.75 V ~ 5.25 V
• Embedded: No
• Utilized Ic / Part: ADIS16362
• Lead Free Status / RoHS Status: Lead free / RoHS compliant by exemption
• Interface: -
• Lead Free Status / RoHS Status: Lead free / RoHS compliant by exemption

ADIS16362
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ........................................................................ 9
REVISION HISTORY
2/11—Rev. C to Rev. D
Changed 0xAB08 to 0xAA08, Table 31 ....................................... 16
2/11—Rev. B to Rev. C
Changes to Gyroscopes Misalignment and Accelerometers
Misalignment Test Conditions/Comments, Table 1 .................... 3
Changes to Table 30 and Table 31 ................................................ 16
12/09—Rev. A to Rev. B
Changes to Features Section............................................................ 1
Added Sensor Bandwidth Section ................................................ 13
Added Figure 14; Renumbered Sequentially .............................. 13
Changes to Digital Filtering Section ............................................ 13
Timing Specifications .................................................................. 5
Timing Diagrams .......................................................................... 5
ESD Caution .................................................................................. 6
Basic Operation ............................................................................ 9
Reading Sensor Data .................................................................... 9
Device Configuration .................................................................. 9
Rev. D | Page 2 of 20
Applications Information .............................................................. 17
Outline Dimensions ....................................................................... 18
11/09—Rev. 0 to Rev. A
Change to Features Section .............................................................. 1
Changes to Table 8 .......................................................................... 10
Changes to Product Identification Section ................................. 16
8/09—Revision 0: Initial Version
Memory Map .............................................................................. 10
Burst Read Data Collection ...................................................... 11
Output Data Registers................................................................ 11
Calibration................................................................................... 12
Operational Control ................................................................... 12
Input/Output Functions ............................................................ 14
Diagnostics .................................................................................. 15
Product Identification ................................................................ 16
Installation/Handling................................................................. 17
Gyroscope Bias Optimization ................................................... 17
Input ADC Channel ................................................................... 17
Interface Printed Circuit Board (PCB) .................................... 17
Ordering Guide .......................................................................... 18