SKM300GM12T4 SEMIKRON, SKM300GM12T4 Datasheet - Page 2

IGBT Module

SKM300GM12T4

Manufacturer Part Number
SKM300GM12T4
Description
IGBT Module
Manufacturer
SEMIKRON
Datasheet

Specifications of SKM300GM12T4

Dc Collector Current
422A
Collector Emitter Voltage Vces
1.2kV
Collector Emitter Voltage V(br)ceo
800mV
No. Of Pins
7
Package / Case
SEMITRANS 3
Family/system
SEMITRANS
Voltage (v)
1200
Current (a)
300
Chip-type
IGBT 4 Fast (Trench)
Case
SEMITRANS 3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
SKM300GM12T4
Fast IGBT4 Modules
SKM300GM12T4
Features
• V
• High short circuit capability, self
• Fast & soft inverse CAL diodes
• Large clearance (10 mm) and
• Isolated copper baseplate using DBC
Typical Applications
• Matrix Inverter
Remarks
• Case temperature limited to
2
SEMITRANS
T
T
rel. results valid for T
coefficient
limiting to 6 x Icnom
creepage distances (20 mm)
Technology (Direct Copper Bonding)
c
op
CE(sat)
= 125°C max, recomm.
= -40 ... +150°C, product
with positive temperature
GM
j
®
= 150°
3
Characteristics
Symbol
Inverse diode
V
V
r
I
Q
E
R
Module
L
R
R
M
M
w
F
RRM
CE
F
F0
rr
th(j-c)
CC'+EE'
th(c-s)
rr
s
t
= V
EC
Rev. 0 – 22.06.2009
I
V
chip
I
di/dt
V
V
terminal-chip
Conditions
per diode
per module
to heat sink M6
F
F
GE
GE
CC
= 300 A
= 300 A
off
= 0 V
= ±15 V
= 600 V
= 7300 A/µs
T
T
T
T
T
T
T
T
T
T
T
to terminals M6
j
j
j
j
j
j
j
j
j
C
C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 25 °C
= 125 °C
min.
2.5
3
typ.
2.17
2.11
0.25
0.02
345
1.3
0.9
2.9
4.0
0.5
54
23
15
© by SEMIKRON
0.038
max.
2.49
2.42
0.17
325
1.5
1.1
3.3
4.4
20
5
5
Unit
K/W
K/W
mΩ
mΩ
mΩ
mΩ
Nm
Nm
Nm
µC
mJ
nH
V
V
V
V
A
g

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