PAQ100S48-3R3 TDK Corporation, PAQ100S48-3R3 Datasheet - Page 25

• Manufacturer Part Number: PAQ100S48-3R3
• Description: LAMBDA PART
• Manufacturer: TDK Corporation

Specifications of PAQ100S48-3R3

• Rohs Compliant: YES

・All specifications are subject to change without notice.
PAQ
By the following instruction shown in Fig2-1, mount power
module onto printed circuit board.
1 Method to Fix
To fix a power module onto printed circuit board, use M3
screws and mount it to the tapped holes (2 places) of the
module. Recommended torque is 0.54N･m.
1 Method to Fix
To fix the power module onto heatsink, use M3 screws and
mount it to the tapped holes (2 places) at the baseplate
side. Recommended torque is 0.54N･m.
Use with thermal grease or thermal sheet in between heat-
sink and baseplate to minimize the contact thermal resis-
tance and to enhance the heat conductivity. Also use the
no-warped heatsink and make sure good contact between
baseplate and heatsink.
The vibration specification of the module is determined as-
suming that only the power module is mounted on printed
circuit board. To prevent excessive force to the module
Fig2-1. Installation of Printed Circuit Board and Heatsink
100S48-*/B
3. Heatsink Installation Method
2. PCB Mounting Method
M3 Screw
Spring Washer
Plain Washer
Heatsink
Silicone grease
Power Module
M3 Mounting Tap
Printed Circuit Board
Plain Washer
Spring Washer
M3 Screw
4. Vibration
2 M3 Mounting Tapped Holes
M3 mounting tapped holes of power module are connect-
ed to baseplate. Connect baseplate terminal to FG (Frame
Ground) by using this M3 mounting tapped holes.
3 Mounting Holes on Printed Circuit Board
Refer to the following sizes when determining diameter of
hole and land diameter of printed circuit board.
PAQ100S48/B
Input/Signal terminal pin (φ1.0mm)
Output terminal pin (φ1.5mm)
M3 Mounting Tap (FG)
4 Clearance from Customer Board
Minimum clearance between PAQ100S48/B and a cus-
tomer board is 1.5mm
The power module may influence by noise, care must be
taken when wire the signal line.
2 Mounting Hole of Heatsink
The recommended mounting hole diameter of the heatsink
is φ3.5mm.
aud the printed circuit board, fix the heatsink to the chas-
sis as well as to the module when a large size of heatsink
is used.
Hole diameter: φ1.5mm
Land diameter: φ2.5mm
Hole diameter: φ2.0mm
Land diameter: φ3.5mm
Hole diameter: φ3.5mm
Land diameter: φ5.5mm
B-249
PAQ