ADP323ACPZ Analog Devices Inc, ADP323ACPZ Datasheet - Page 5

• Manufacturer Part Number: ADP323ACPZ
• Description: IC, LDO, TRIPLE, ADJ, 0.2A, 16LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADP323ACPZ

• Primary Input Voltage: 5.5V
• Dropout Voltage Vdo: 110mV
• No. Of Pins: 16
• Output Current: 200mA
• Voltage Regulator Case Style: LFCSP
• Operating Temperature Range: -40°C To +125°C
• Output Voltage Adjustable Range: 0.5V To 5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN1/VIN2, VIN3, VBIAS to GND
VOUT1, VOUT2, FB1, FB2 to GND
VOUT3, FB3 to GND
EN1, EN2, EN3 to GND
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Stresses above those listed under absolute maximum ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination.
The ADP322/ADP323 triple LDO can be damaged when the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that the junction temperature
(T
with high power dissipation and poor thermal resistance, the
maximum ambient temperature may have to be derated. In
applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits.
The junction temperature (T
ambient temperature (T
(P
package (θ
from the ambient temperature (T
using the following formula:
D
J
) is within the specified temperature limits. In applications
), and the junction-to-ambient thermal resistance of the
T
J
= T
JA
A
). Maximum junction temperature (T
+ (P
D
× θ
JA
)
A
), the power dissipation of the device
J
) of the device is dependent on the
A
) and power dissipation (P
Rating
–0.3 V to +6.5 V
–0.3 V to VIN1/VIN2
–0.3 V to VIN3
–0.3 V to +6.5 V
–65°C to +150°C
–40°C to +125°C
JEDEC J-STD-020
J
) is calculated
D
Rev. 0 | Page 5 of 24
)
Junction-to-ambient thermal resistance (θ
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending
on PCB material, layout, and environmental conditions. The
specified values of θ
circuit board. See JEDEC JESD 51-9 for detailed information
on the board construction. For additional information, see the
AN-617 Application Note, MicroCSP™ Wafer Level Chip Scale
Package.
Ψ
with units of °C/W. Ψ
calculation using a 4-layer board. The JESD51-12, Guidelines for
Reporting and Using Package Thermal Information, states that
thermal characterization parameters are not the same as thermal
resistances. Ψ
multiple thermal paths rather than a single path as in thermal
resistance, θ
from the top of the package as well as radiation from the package,
factors that make Ψ
Maximum junction temperature (T
temperature (T
formula:
See JEDEC JESD51-8 and JESD51-12 for more detailed inform-
ation about Ψ
THERMAL RESISTANCE
θ
device soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
16-Lead, 3 mm × 3 mm LFCSP
ESD CAUTION
JA
JB
and Ψ
is the junction to board thermal characterization parameter
T
J
= T
JB
B
are specified for the worst-case conditions, that is, a
JB
+ (P
. Therefore, Ψ
JB
JB
.
B
measures the component power flowing through
) and power dissipation (P
D
× Ψ
JB
JA
JB
more useful in real-world applications.
are based on a 4-layer, 4 inch × 3 inch
JB
)
of the package is based on modeling and
JB
thermal paths include convection
J
) is calculated from the board
ADP322/ADP323
θ
49.5
JA
JA
D
) of the package is
) using the following
Ψ
25.2
JB
Unit
°C/W