1243S08-U THAT Corporation, 1243S08-U Datasheet - Page 8

• Manufacturer Part Number: 1243S08-U
• Description: Difference Amplifiers Balanced Input Line Receiver -3dB SO-8
• Manufacturer: THAT Corporation

Specifications of 1243S08-U

• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: 0 C to + 85 C
• Output Current: +/- 25 mA
• Operating Supply Voltage: +/- 18 V
• Package / Case: SOIC-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Document 600035 Rev 04
and 8-pin surface mount (SOIC) packages. Package
dimensions are shown below;
The lead-frames are copper, plated with successive
layers of nickel, palladium, and gold. This approach
makes it possible to solder these devices using lead-
free and lead-bearing solders.
Parameter
Through-hole package
Surface mount package
K
Thermal Resistance
Environmental Regulation Compliance
Thermal Resistance
Soldering Reflow Profile
Moisture Sensitivity Level
Environmental Regulation Compliance
D
Figure 14. -P (DIP) version package outline drawing
The THAT 1240 series is available in 8-pin PDIP
The 1240 series packages are entirely lead-free.
ITEM
1
G
A
B
C
D
E
F
H
K
J
MILLIMETERS
9.52
6.35
7.49/8.13
0.46
2.54
3.68/4.32
0.25
3.18
8.13/9.40
3.30
A
E
±
±
±
±
0.10
0.10
0.10
0.10
Tel: [phone]; Fax: [phone]; Web: www.thatcorp.com
B
F
THAT Corporation; 45 Sumner Street; Milford, MA 01757-1656; USA
H
Symbol
C
INCHES
0.375
0.250
0.295/0.320
0.018
0.100
0.145/0.170
0.010
0.125
0.320/0.370
0.130
MSL
θ
θ
JA
JA
±0.004
±
±
±
0.004
0.004
0.004
Package Characteristics
Above-referenced JEDEC soldering profile
G
Copyright © 2008, THAT Corporation
Package Information
DIP package soldered to board
SO package soldered to board
See Fig. 14 for dimensions
See Fig. 15 for dimensions
J
Page 8 of 8
Conditions
compounds used in the 1240-series contains any
hazardous substances as specified in the European
Union's Directive on the Restriction of the Use of
Certain Hazardous Substances in Electrical and
Electronic Equipment 2002/95/EG of January 27,
2003. The surface-mount package is suitable for use
in a 100% tin solder process
D
Complies with January 27, 2003 RoHS requirements
Complies with January 27, 2003 RoHS requirements
Figure 15. -S (SO) version package outline drawing
Neither the lead-frames nor the plastic mold
ITEM
A
B
C
D
E
F
G
H
E
JEDEC JESD22-A113-D (250 ºC)
A
MILLIMETERS
4.80/4.98
3.81/3.99
5.80/6.20
0.36/0.46
1.27
1.35/1.73
0.19/0.25
0.41/1.27
Min
8 Pin PDIP
8 Pin SOP
B
Typ
100
150
1
Balanced Line Receiver ICs
C
INCHES
0.189/0.196
0.150/0.157
0.228/0.244
0.014/0.018
0.050
0.053/0.068
0.0075/0.0098
0.016/0.05
Max
G
THAT 1240 Series
F
Units
ºC/W
ºC/W
H