VEMD2520X01 Vishay, VEMD2520X01 Datasheet - Page 4

• Manufacturer Part Number: VEMD2520X01
• Description: Photodiodes PHOTO PIN DIODE
• Manufacturer: Vishay

Specifications of VEMD2520X01

• Peak Wavelength: 900 nm
• Half Intensity Angle Degrees: 15 deg
• Maximum Reverse Voltage: 60 V
• Maximum Power Dissipation: 215 mW
• Maximum Light Current: 0.012 mA
• Maximum Dark Current: 10 nA
• Maximum Rise Time: 100 ns
• Maximum Fall Time: 100 ns
• Package / Case: Gull Wing
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Wavelength Typ: 900nm
• Half Angle: 15°
• Dark Current: 1nA
• Diode Case Style: SMD
• No. Of Pins: 2
• Operating Temperature Range: -40°C To +100°C
• Breakdown Voltage Vbr: 32V
• Rohs Compliant: Yes
• Svhc: No SVHC (20-Jun-2011)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

VEMD2500X01, VEMD2520X01
Vishay Semiconductors
REFLOW SOLDER PROFILE
PACKAGE DIMENSIONS in millimeters: VEMD2500X01
www.vishay.com
4
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
19841
300
250
200
150
100
50
0
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
max. 120 s
100
Drawing-No.: 6.544-5391.02-4
Issue: 2; 18.03.10
21517
Time (s)
150
Cathode
For technical questions, contact:
1.7
max. 100 s
max. 30 s
200
max. 260 °C
250
This datasheet is subject to change without notice.
245 °C
Pin ID
2.3 ± 0.2
5.8 ± 0.2
0.4
2.2
6.7
300
Silicon PIN Photodiode
acc. IPC 7351
Solder pad proposal
Z
Ø 2.3 ± 0.1
Anode
[e-mail]
exposed copper
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Z 20:1
amb
Ø 1.8 ± 0.1
2.2
Not indicated tolerances ± 0.1
< 30 °C, RH < 60 %
technical drawings
according to DIN
specifications
1.1 ± 0.1
www.vishay.com/doc?91000
Document Number: 83294
Rev. 1.1, 22-Mar-11