73M2901CE-IGVR/F Maxim Integrated Products, 73M2901CE-IGVR/F Datasheet

no-image

73M2901CE-IGVR/F

Manufacturer Part Number

73M2901CE-IGVR/F

Description

IC MODEM 3.3V V.22BIS 32-TQFP

Manufacturer

Maxim Integrated Products

Datasheet

1.73M2901CE-IGVRF.pdf (27 pages)

Specifications of 73M2901CE-IGVR/F

Data Format

V.21, V.22, V.23, Bell 103, Bell 212A

Baud Rates

300 ~ 9.6k

Interface

Serial

Voltage - Supply

2.7 V ~ 3.6 V

Mounting Type

Surface Mount

Package / Case

32-TQFP

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

73M2901CE-IGVR/F

Manufacturer:

MAXIM

Quantity:

1 000

Company:

BOSTOCK HK LIMITED

BOSTOCK HK LIMITED

Part Number:

73M2901CE-IGVR/F

Manufacturer:

MAXIM

Quantity:

1 005

Company:

BOSTOCK HK LIMITED

BOSTOCK HK LIMITED

Part Number:

73M2901CE-IGVR/F

Manufacturer:

Maxim Integrated

Quantity:

10 000

Current page: 1 of 27
Download datasheet (514Kb)

Simplifying System Integration™

DS_2901CE_031

DESCRIPTION

The 73M2901CE low speed modem integrates a

data pump, controller, and analog front end in a

3.3 V device with a powerful "AT" command host

interface. The modem reduces external

component count/cost by incorporating many

features like parallel phone detect, Line-In-Use

and Ring detection in software without requiring

additional components.

The device is a "one chip fits all” solution for

applications including set-top boxes, point-of-sale

terminals, automatic teller machines, utility

meters, vending machines and smart card

readers.

Another distinctive feature of this device is pin

compatibility with Teridian’s flagship embedded

hard modems, the 73M2901CL, and the

73M1903 soft modem AFE. This offers

customers a cost effective method to design for

both hard or soft modem solutions in the same

system as a risk-free cost reduction path.

Complete support, modem reference designs

and error correction software are part of the

solution offered by Teridian. Our in-house

application engineering team is here to help

meet your international certification needs.

Rev. 3.4

© 2010 Teridian Semiconductor Corporation

FEATURES

•

•

•

•

•

•

•

•

•

•

•

•

•

•

•

•

•

•

V.22bis Single Chip Modem

True one chip solution for embedded systems

As low as 9.5 mA operating with standby and

power down mode available

Power supply operation from 3.6 V to 2.7 V

Data modes and speeds:

V.22bis – 2400 bps

V.22/Bell212 – 1200 bps

V.21/Bell103 – 300 bps

V.23 – 1200/75 bps (with PAVI turnaround)

Bell202 – 1200 bps

Bell202/V23 1200 bps FDX 4-wire operation

V.22/Bell 212A/V.22bis synchronous modes

International Call Progress support:

FCC part 68, CTR21, JATE, etc.

DTMF generation and detection

Worldwide Caller ID capability

U.S. Type I and II support

EIA 777A compliant

SIA-2000 compliant

SMS messaging support

On chip hybrid driver

Blacklisting capability

Line-In-Use and Parallel Pick-Up (911) detection

with voltage or low cost energy detection method

Incoming ring energy detection through CID

path; no optocoupler circuitry required

Manufacturing Self Test capability

Backward compatible with 73M2901CL

Packaging: 32 lead QFN, 32-pin TQFP

DATA SHEET

73M2901CE

January 2010

1

Related parts for 73M2901CE-IGVR/F

Related keywords

73M2901CE-IGVR/F datasheet
73M2901CE-IGVR/F data sheet
73M2901CE-IGVR/F pdf datasheet
73M2901CE-IGVR/F component
73M2901CE-IGVR/F part
73M2901CE-IGVR/F distributor
73M2901CE-IGVR/F RoHS
73M2901CE-IGVR/F datasheet download