MPX12GP Freescale Semiconductor, MPX12GP Datasheet - Page 6

• Manufacturer Part Number: MPX12GP
• Description: SENSOR GAUGE PRESS 1.45PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX12r
• Type: Gager

Specifications of MPX12GP

• Pressure Type: Gauge
• Operating Pressure: 1.45 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0 ~ 55mV
• Voltage - Supply: 3V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP
• Pressure Range: 0 to 10KPa
• Overload Pressure (max): 75KPa
• Mounting: Through Hole
• Pin Count: 4
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package Type: Case 344B-01
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (max): 6V
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3 V
• Full Scale Span: 55mV
• Ic Function: Pressure Sensor IC
• Leaded Process Compatible: Yes
• Linearity Max (v): 0.5
• Linearity Min (v): -0.5
• Offset Voltage Max: 35mV
• Operating Pressure Max: 10psi
• Over Pressure: 75kPa
• Rohs Compliant: Yes
• Sensitivity, V/p: 5.5mV/kPa
• Supply Current: 6mA
• No. Of Pins: 4
• Supply Voltage Range: 3V To 6V
• Operating Temperature Range: -40°C To +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPX12
6
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
qualification tests are based on use of dry clean air as the
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing gel which isolates
the die from the environment. Freescale’s MPx12 series is
designed to operate with positive differential pressure
applied, P1 > P2.
following table
Figure 4
Operating characteristics, internal reliability and
Freescale designates the two sides of the pressure sensor
The Pressure (P1) side may be identified by using the
Pressure
illustrates the differential/gauge die. A gel isolates
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Lead Frame
Wire Bond
Figure 4. Cross-Sectional Diagram (not to scale)
Differential Sensing
Gel Die Coat
Element
P1
P2
pressure media. Media other than dry clean air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
MPX12D
MPX12DP
MPX12GP
MPXV12DP
MPXV12GP
MPXV12GW6U
MPXV12GW7U
MPXM12GS/GST1
Die
Part Number
Steel Cap
Stainless
Die Bond
Thermoplastic
Case
Case Type
1320A
344C
344B
1351
1369
1735
1560
344
Freescale Semiconductor
Side with Port Attached
Side with Port Attached
Side with Part Marking
Side with Part Marking
Pressure (P1) Side
Stainless Steel Cap
Side with Port
Side with Port
Side with Port
Identifier
Sensors