MPX2100GP Freescale Semiconductor, MPX2100GP Datasheet - Page 5

• Manufacturer Part Number: MPX2100GP
• Description: SENSOR GAUGE PRESS 14.5 PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX2100r
• Type: Gager

Specifications of MPX2100GP

• Pressure Type: Gauge
• Operating Pressure: 14.5 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0 ~ 40mV
• Voltage - Supply: 16V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP
• Pressure Range: 0 to 100KPa
• Overload Pressure (max): 400KPa
• Mounting: Screw
• Pin Count: 4
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package Type: Case 344B-01
• Operating Supply Voltage (typ): 10V
• Operating Supply Voltage (max): 16V
• Mounting Style: Screw
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 10 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
On-Chip Temperature Compensation and Calibration
MPX2100 series at 25°C. The output is directly proportional
to the differential pressure and is essentially a straight line.
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
Lead Frame
Wire Bond
Silicone Gel
Die Coat
Figure 3
Figure 4
shows the output characteristics of the
illustrates the absolute sensing configuration
Differential/Gauge
Die
Differential/Gauge
P1
P2
kPa
PSI
40
35
30
25
20
15
10
-5
5
0
Element
0
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 3. Output versus Pressure Differential
V
T
Stainless Steel
Metal Cover
S
A
P1 > P2
= 10 Vdc
= 25°C
MAX
3.62
25
Bond
Die
Epoxy
Case
TYP
7.25
50
MIN
are very small and are shown under Operating
Characteristics.
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Lead Frame
Wire Bond
10.87
The effects of temperature on Full-Scale Span and Offset
The MPX2100 series pressure sensor operating
75
Silicone Gel
Die Coat
14.5
100
Range
Span
(Typ)
Absolute
Die
Offset
(Typ)
Absolute Element
P1
P2
Metal Cover
Stainless Steel
Pressure
Bond
Die
MPX2100
Epoxy
Case
5