MPX4250DP Freescale Semiconductor, MPX4250DP Datasheet - Page 4

SENSOR DIFF PRESS 36 PSI MAX

MPX4250DP

Manufacturer Part Number
MPX4250DP
Description
SENSOR DIFF PRESS 36 PSI MAX
Manufacturer
Freescale Semiconductor
Series
MPX4250r
Datasheets

Specifications of MPX4250DP

Pressure Type
Differential
Operating Pressure
0 ~ 36.3 PSI
Port Size
Male, 0.194" (4.9276mm) Tube
Output
0.2 ~ 4.9V
Accuracy
±1.4%
Voltage - Supply
4.85 V ~ 5.35 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
6-SIP Dual Ports
Mounting Style
Through Hole
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
5.1 V
Supply Voltage (min)
4.85 V
Supply Voltage (max)
5.35 V
Supply Current
7 mA
Output Voltage
4.9 V
Shutdown
No
Operating Pressure Range
0 To 250kPa
Connection Size
4.928mm
Sensitivity, V/p
18.8mV/kPa
Sensor Case Style
SIP
No. Of Pins
6
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPX4250DP
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MPX4250DP
0
MPX4250
4
On-chip Temperature Compensation and Calibration
chip in the basic chip carrier (Case 867). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
.
Figure 2
The MPX4250 series pressure sensor operating
Pressure
illustrates the differential/gauge pressure sensing
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1535)
5.0
4.0
3.5
2.0
0.5
4.5
3.0
2.5
1.5
1.0
0
Lead Frame
Wire Bond
Transfer Function:
V
V
Temperature = 0 to 85°C
out
S
= 5.1 Vdc
Figure 2. Cross Sectional Diagram (not to scale)
= V
1.0 μF
s
Figure 4. Output versus Absolute Pressure
* (0.00369*P + 0.04) ± Error
MAX
Fluoro Silicone
Die Coat
0.01 μF
Die
V
Pressure in kPa
+5.1 V
s
P1
P2
GND
IPS
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller.
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
output will saturate outside of the specified pressure range
V
MIN
out
Figure 3
Figure 4
Stainless Steel
Metal Cover
shows the recommended decoupling circuit for
shows the sensor output signal relative to
470 pF
Output
RTV Die Bond
TYP
Epoxy Case
Freescale Semiconductor
Figure
Sensors
3. The

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