MPXA6115AC6U Freescale Semiconductor, MPXA6115AC6U Datasheet
MPXA6115AC6U
Specifications of MPXA6115AC6U
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MPXA6115AC6U Summary of contents
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... Temperature Compensated from -40° to +125°C • Durable Thermoplastic (PPS) Surface Mount Package Case Device Name No. Small Outline Package (MPXA6115A Series) MPXA6115A6U 482 MPXA6115A6T1 482 MPXA6115AC6U 482A MPXA6115AC6T1 482A MPXA6115AC7U 482C Small Outline Package (Media Resistant Gel) (MPXAZ6115A Series) MPXAZ6115A6U 482 MPXAZ6115AC6U ...
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... MPXHZ6115AC6U 1317A MPXHZ6115AC6T1 1317A MPXA6115A6U/T1 MPXAZ6115A6U CASE 482 MPXA6115A 2 ORDERING INFORMATION • • • • SMALL OUTLINE PACKAGES MPXA6115AC6U/T1 MPXA6115AC7U MPXAZ6115AC6U/T1 CASE 482C CASE 482A SUPER SMALL OUTLINE PACKAGES MPXH6115AC6U/T1 MPXH6115A6U/T1 MPXHZ6115AC6U/T1 MPXHZ6115A6U/T1 CASE 1317A CASE 1317 • MPXHZ6115A • MPXHZ6115A • ...
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... Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Sensors Freescale Semiconductor = 5.0 Vdc 25°C unless otherwise noted, P1 > P2) ...
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... Gain Stage #2 Temperature and Ground Compensation Reference and Shift Gain Stage #1 Circuitry 3 Pins and 8 are NO CONNECTS GND Value Units 400 kPa °C -40° to +125° °C -40° to +125° 0.5 mAdc -0.5 mAdc the application circuit. out OUT Freescale Semiconductor Sensors ...
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... Sensors Freescale Semiconductor A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXxx6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media ...
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... MPXA6115A 6 x (0.009 0.095 MPXxxA6115A SERIES Break Points Temp Multiplier - 125 1.75 -40 - Temperature in Cº Error Limits for Pressure 100 120 80 100 120 140 Pressure (in kPa) Pressure Error (Max 115 (kPa) ±1.5 (kPa) Sensors Freescale Semiconductor ...
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... TYP 8X 1.52 Figure 6. SSOP Footprint (Case 1317 and 1317A) Sensors Freescale Semiconductor solder reflow process always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. ...
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... G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 -T- Sensors Freescale Semiconductor ...
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... N –B– Sensors Freescale Semiconductor PACKAGE DIMENSIONS 0.25 (0.010 DETAIL X W PIN 1 IDENTIFIER C –T– DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE Pressure NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION ...
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... Pressure MPXA6115A 10 PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...
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... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE Pressure PAGE MPXA6115A 11 ...
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... Pressure MPXA6115A 12 PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...
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... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE Pressure PAGE MPXA6115A 13 ...
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... Pressure MPXA6115A 14 PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...
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... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE Pressure PAGE MPXA6115A 15 ...
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... Pressure MPXA6115A 16 PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...
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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...