MF1PLUS8011DA4/02 NXP Semiconductors, MF1PLUS8011DA4/02 Datasheet - Page 3

• Manufacturer Part Number: MF1PLUS8011DA4/02
• Description: IC SMART CARD 4KB EEPROM MOA4
• Manufacturer: NXP Semiconductors
• Series: MIFARE PLUS™r

Specifications of MF1PLUS8011DA4/02

• Rf Type: Read / Write
• Frequency: 13.56MHz
• Features: ISO14443A / Mifare
• Package / Case: PLLMC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
5. Ordering information
Table 2.
MF1PLUSX0Y1_SDS_31
Product short data sheet
PUBLIC
Type number
MF1PLUS8001DUD/03
MF1PLUS8001DA4/03
MF1PLUS8011DUD/03
MF1PLUS8021DUD/03
MF1PLUS8011DA4/03
MF1PLUS8021DA4/03
MF1PLUS6001DUD/03
MF1PLUS6001DA4/03
MF1PLUS6011DUD/03
MF1PLUS6021DUD/03
MF1PLUS6011DA4/03
MF1PLUS6021DA4/03
Ordering information
Package
Commercial
name
FFC
MOA4
FFC
FFC
MOA4
MOA4
FFC
MOA4
FFC
FFC
MOA4
MOA4
All information provided in this document is subject to legal disclaimers.
Name
-
PLLMC
-
-
PLLMC
PLLMC
-
PLLMC
-
-
PLLMC
PLLMC
Rev. 3.1 — 19 April 2010
163531
Description
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 4-byte UID, UID0 = XFh
according to ISO/IEC 14443-3, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1
card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 4-byte UID, UID0 = XFh
according to ISO/IEC 14443-3, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1
card
Mainstream contactless smart card IC
MF1PLUSx0y1
Ref.
Ref.
Ref.
Ref.
Ref.
Ref.
3,
3,
3,
3,
3,
3,
© NXP B.V. 2010. All rights reserved.
Version
-
SOT500-2
-
-
SOT500-2
SOT500-2
-
SOT500-2
-
-
SOT500-2
SOT500-2
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