HT1MOA2S30/E/3,118 NXP Semiconductors, HT1MOA2S30/E/3,118 Datasheet

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HT1 MOA3 S30 TM HITAG 1 Chip Module Preliminary Specification Revision 1.1 August 1997 ...

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Specifications of the HT1 MOA3 S30 Table of Contents 1 Definitions .............................................................................................................................. 3 1.1 Objective of the Specifications ..................................................................................................................... 3 1.2 Definition of the Chip Module ..................................................................................................................... 3 1.3 Use of the Modules ...................................................................................................................................... 3 2 Specifications ......................................................................................................................... 4 2.1 ...

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Specifications of the HT1 MOA3 S30 1 Definitions 1.1 Objective of the Specifications This specification lists the parameters to be fulfilled by the HITAG 1 chip module HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs). ...

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Specifications of the HT1 MOA3 S30 2 Specifications 2.1 Mechanical Properties Width (Proposed Punching Outline) Length (Proposed Punching Outline) Overall Thickness Film Thickness Bondpad Size for Transponder Coil / Module Interconnection 2.2 Materials Tape Copper Plating Bond Plating Backside Plating ...

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Specifications of the HT1 MOA3 S30 2.4 Storage Conditions Temperature °C Relative Humidity Duration 1 year 2.5 Delivery Conditions Delivery Identification Date of ready for shipment, reel numbers, total quantity of good modules ...

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Specifications of the HT1 MOA3 S30 2.6 Electrical Specifications Symbol Absolute Maximum Ratings Junction Temperature T Input Peak Current I Latch up Current ESD Operating Range Temperature Input Threshold Voltage Input Read Voltage ...

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Specifications of the HT1 MOA3 S30 3 Drawing of the Chip Module HT1 MOA3 S30 3.1 Drawing of the Reel Ht1moa3.doc/HS Rev. 1.1 Page 1997-08-19 ...

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Specifications of the HT1 MOA3 S30 3.2 Module outline suggestion Ht1moa3.doc/HS Rev. 1.1 Page 1997-08-19 ...

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Specifications of the HT1 MOA3 S30 3.3 Splicing Specification Ht1moa3.doc/HS Rev. 1.1 Page 1997-08-19 ...

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Specifications of the HT1 MOA3 S30 4 Coil Specifications The HITAG 1 chip module has to be connected to a coil whose parameters are briefly described in the following. Equivalent circuit of the transponder Xpc Rpc U ... voltage at ...

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Specifications of the HT1 MOA3 S30 For a rough estimation ( the number of coil windings following formula can be used assumed that the winding is done in circular form ...

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Specifications of the HT1 MOA3 S30 5 Functional Description of HITAG 1 5.1 Memory Organization The 2 kBit EEPROM memory on the transponder is divided into 16 blocks. Every block consists of 4 pages. A page is the smallest access ...

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Specifications of the HT1 MOA3 S30 Blocks can be used either as secret or public areas (configurable), and Blocks either as read / write or read only areas (configurable). You can also modify keys ...

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Specifications of the HT1 MOA3 S30 5.3 Operation Modes and Configuration 5.3.1 Modes of Operation The HITAG 1 can be operated in two modes (Standard Protocol Mode, Advanced Protocol Mode) that cannot be configured using the Configuration Page, but via ...

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Specifications of the HT1 MOA3 S30 Configuration Byte Configuration Byte 0 / Bit 7: Bit 7 = ‘1’: Logdata can be read and written to. Bit 7 = ‘0’: Logdata cannot be accessed. ...

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Specifications of the HT1 MOA3 S30 Configuration Byte Configuration Byte 1 / Bits 5 ... 7: These three bits are reserved. ATTENTION: When writing a new value to Configuration Byte 1, bit positions ...

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Specifications of the HT1 MOA3 S30 5.4 Configuration of Delivered HITAG 1 Transponders HITAG 1 transponders are delivered with the following configuration by Philips Semiconductors: Unique Serial Number: Serial Number: Read Only Configuration Byte 0: Logdata: ‘1’ = r/w Key ...

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Specifications of the HT1 MOA3 S30 It is important that the following values are in accordance with each other, i.e. the respective data on the read/write device and on the transponder have to be identical pairs: on the read/write device ...

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Specifications of the HT1 MOA3 S30 6 Quality Inspection Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with AQL1.0. Optical Properties scratches, encapsulation failures, gold discolouration, delamination Geometrical Properies width length overall thickness Electrical ...

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Specifications of the HT1 MOA3 S30 7 Characterisation and Test of the Final Transponder 7.1 Characterisation of the Transponder The parameters recommended to be characterised for the transponder are: Parameter Resonant frequency Threshold value Threshold value for READ Threshold value ...

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Specifications of the HT1 MOA3 S30 8 Ordering Information Type Name Description HT1 MOA3 S30/E/3 HITAG 1 S30 Chip Module, reels HT1 MOA3 S30/E/1 HITAG 1 S30 Chip Module, bulk Ht1moa3.doc/HS Rev. 1.1 Ordering Number 9352 600 61118 9352 602 ...

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Specifications of the HT1 MOA3 S30 Definitions Data sheet status Objective specification This data sheet conta ins ta rget o r goal spec ifications for product deve lopment. Preliminary specification This data sheet conta ins p reliminary data; supp lementary ...

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Specifications of the HT1 MOA3 S30 Ht1moa3.doc/HS Rev. 1.1 - this page intentionally left blank - Page 1997-08-19 ...

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Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTHRYDE, NSW 2113, Tel. +612 9805 4455, Fax. +612 9805 4466 Austria: Computerstraße 6, A-1101 WIEN, P.O.Box 213, Tel. +431 60 101, Fax. +431 30 101 ...