STEVAL-TDR019V1 STMicroelectronics, STEVAL-TDR019V1 Datasheet
STEVAL-TDR019V1
Specifications of STEVAL-TDR019V1
Related parts for STEVAL-TDR019V1
STEVAL-TDR019V1 Summary of contents
Page 1
Features ■ Excellent thermal stability ■ Common source configuration ■ Broadband performances with 17 dB gain @ 870 MHz OUT ■ Plastic package ■ ESD protection ■ Supplied in tape and reel ■ In compliance with ...
Page 2
Contents Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 3
PD85004 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (T Symbol V (BR)DSS DISS STG 1.2 Thermal data Table 3. Thermal data Symbol R thJC CASE Parameter Drain-source voltage ...
Page 4
Electrical characteristics 2 Electrical characteristics T = +25 CASE 2.1 Static Table 4. Static Symbol DSS GSS 13.6 V GS( ...
Page 5
PD85004 3 Impedances Figure 2. Impedances Table 8. Broadband impedances F(MHz) 860 880 900 920 940 960 Z GS 2.46+ j 6.63 2.59+ j 6.83 2.63+ j 6.97 2.57+ j 7.09 2.42+ j 7.17 2.27+ j 7.34 Impedances Z DL ...
Page 6
DC curves 4 DC curves Figure 3. DC output characteristics Figure 5. Capacitances vs drain voltage 6/18 Figure 4. VGS=10V VGS=9V VGS=8V VGS=7V VGS=6V VGS=5V VGS=4V CRSS COSS CISS 6 ...
Page 7
PD85004 5 RF curves Figure 6. Output power and drain efficiency vs frequency 13 Pin = 19 dBm 860 880 900 920 Frequency (MHz) Figure 8. Input return loss vs ...
Page 8
RF curves Figure 12. Harmonics vs frequency 13 -10 -20 -30 -40 -50 -60 -70 -80 860 880 900 Frequency (MHz) 8/ 920 940 960 PD85004 ...
Page 9
PD85004 6 Schematic and BOM Figure 13. Schematic MSub FR4 H=20 mil RFin TL1 TL2 TL3 LDMOS C8 C9 C10 PD85004 Schematic and BOM TL4 TL5 TL6 C11 C12 ...
Page 10
... Bourns electronics 1 K 0603 Tyco electronics W= 0. 13.6 mm W=0. 3.5 mm W=0. 4.2 mm W=0. 3.8 mm W=0. 4.2 mm W=0. 11 Ω 60 mils STMicroelectronics FR-4 THk = 0.020" both sides Manufacturer Part code Panasonic EXCELDRC35C Panasonic EXCELDRC35C Murata GRM39-C0G121J50D500 Murata GRM39-X7R102K50C560 Murata GRM39-X7R103K50C560 Panasonic EEVHB1V100P Murata ...
Page 11
PD85004 7 Demonstration board photo Figure 14. Demonstration board photo Demonstration board photo 11/18 ...
Page 12
Package mechanical data 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package ...
Page 13
PD85004 Table 10. SOT-89 mechanical data Dim Figure 15. Package dimensions mm. Min Typ Max 1.4 1.6 0.44 0.56 0.36 0.48 0.35 0.44 0.35 0.44 4.4 4.6 1.62 ...
Page 14
Package mechanical data 8.1 Thermal pad and via design Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of ...
Page 15
PD85004 8.2 Soldering profile Figure 17 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 17. Recommended solder profile Figure 18 shows the recommeded solder for devices with Pb-free terminal ...
Page 16
Package mechanical data Figure 19. Reel information 16/18 PD85004 ...
Page 17
PD85004 9 Revision history Table 11. Document revision history Date 05-Dec-2007 22-Aug-2008 Revision 1 Initial release. 2 Updated marking in Table 1 on page 1 Revision history Changes 17/18 ...
Page 18
... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...