ADG918BRMZ Analog Devices Inc, ADG918BRMZ Datasheet - Page 15

• Manufacturer Part Number: ADG918BRMZ
• Description: IC SW ONE HS SPDT 1.6/2.7V 8MSOP
• Manufacturer: Analog Devices Inc

Specifications of ADG918BRMZ

• Rf Type: General Purpose
• Frequency: 0Hz ~ 2GHz
• Features: SPDT
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Analog Switch Type: SPDT
• No. Of Channels: 1
• Bandwidth: 4GHz
• Turn Off Time: 6.5ns
• Turn On Time: 6.6ns
• Supply Voltage Range: 1.65V To 2.75V
• Operating Temperature Range: -40°C To +85°C
• Frequency (max): 2GHz
• Insertion Loss (max): 1.25dB
• Number Of Switches: Single
• Pin Count: 8
• Package Type: MSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

OUTLINE DIMENSIONS
SEATING
0.90 MAX
0.85 NOM
0.95
0.85
0.75
PLANE
INDICATOR
0.15
0.00
COPLANARITY
PIN 1
3.20
3.00
2.80
PIN 1
Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
12° MAX
0.10
Figure 30. 8-Lead Mini Small Outline Package [MSOP]
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.38
0.22
8
1
0.65 BSC
3.25
3.00 SQ
2.75
VIEW
TOP
3.20
3.00
2.80
3 mm x 3 mm Body, Very Thin, Dual Lead
0.30
0.23
0.18
0.70 MAX
0.65 TYP
Dimensions shown in millimeters
Dimensions shown in millimeters
5
4
SEATING
PLANE
2.95
2.75 SQ
2.55
0.20 REF
Rev. C | Page 15 of 16
5.15
4.90
4.65
0.05 MAX
0.01 NOM
1.10 MAX
0.60 MAX
(CP-8-2)
(RM-8)
0.50
0.40
0.30
0.23
0.08
0.60 MAX
EXPOSED PAD IS CONNECTED INTERNAL LY.
FOR INCREASED RELIABILIT Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE GROUND PLANE.
5
4
(BOTTOM VIEW)
EXPOSED
PAD
1
8
8°
0°
1.89
1.74
1.59
0.50
BSC
PIN 1
INDICATOR
1.60
1.45
1.30
0.80
0.60
0.40
ADG918/ADG919