UPC3220GR-A CEL, UPC3220GR-A Datasheet - Page 32

• Manufacturer Part Number: UPC3220GR-A
• Description: IC DOWNCONVERTER LD 16-SSOP
• Manufacturer: CEL
• Series: UPC3220GRr
• Type: RF IC'sr

Specifications of UPC3220GR-A

• Rf Type: CATV
• Frequency: 30MHz ~ 250MHz
• Number Of Mixers: 1
• Gain: 33dB
• Noise Figure: 7dB
• Secondary Attributes: Down Converter
• Current - Supply: 53.5mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Package / Case: 16-SSOP
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 4.5 V to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your nearby sales office.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
Infrared Reflow
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to V
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
Soldering Method
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Soldering Conditions
CC
line.
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
WS260
HS350
IR260
04/25/2005