HFA3101BZ Intersil, HFA3101BZ Datasheet - Page 2

• Manufacturer Part Number: HFA3101BZ
• Description: IC TRANSISTOR ARRAY UHF 8-SOIC
• Manufacturer: Intersil

Specifications of HFA3101BZ

• Frequency: 0Hz ~ 10GHz
• Number Of Mixers: 1
• Noise Figure: 1.7dB
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Rf Type: -
• Gain: -
• Secondary Attributes: -

Absolute Maximum Ratings
V
V
V
I
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
NOTE:
C
Collector to Base Breakdown Voltage, V
Collector to Emitter Breakdown Voltage, V
Q
Emitter to Base Breakdown Voltage, V
Collector Cutoff Current, I
Emitter Cutoff Current, I
DC Current Gain, h
Collector to Base Capacitance, C
Emitter to Base Capacitance, C
Current Gain-Bandwidth Product, f
Power Gain-Bandwidth Product, f
Available Gain at Minimum Noise Figure, G
Q
Minimum Noise Figure, NF
50Ω Noise Figure, NF
DC Current Gain Matching, h
Q
Input Offset Voltage, V
(Q
Input Offset Current, I
(Q
Input Offset Voltage TC, dV
Q
Collector to Collector Leakage, I
1. θ
2. Test Level: A. Production Tested, B. Typical or Guaranteed Limit Based on Characterization, C. Design Typical for Information Only.
CEO
CBO
EBO
, Collector Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
5
5
3
5
5
5
and Q
and Q
and Q
and Q
and Q
and Q
JA
, Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . 8.0V
, Collector to Base Voltage . . . . . . . . . . . . . . . . . . . . . . . 12.0V
, Emitter to Base Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
is measured with the component mounted on an evaluation PC board in free air.
6
6
4
6
6
6
, and Q
)
)
)
5
FE
and Q
C
, Q
50Ω
PARAMETER
OS
, (Q
EBO
1
, (Q
CBO
, Q
6
thru Q
MIN
1
OS
, Q
5
and Q
FE1
1
, Q
/dT, (Q1 and Q2, Q3 and Q
, Q
and Q
and Q
5
EB
TRENCH-LEAKAGE
2
and Q
6
/h
1
CB
MAX
5
T
T
thru Q
FE2
2
and Q
A
), (Q
6
2
= 25
(BR)EBO
, Q
), (Q
6
(BR)CBO
3
4
6
1
(BR)CEO
o
and Q
3
NFMIN
and Q
C
and Q
Q
Q
Q
Q
Q
Q
Q
Q
, Q
, Q
1
5
1
5
1
5
1
5
4
2
thru Q
and Q
thru Q
and Q
thru Q
and Q
thru Q
and Q
),
1
,
,
1
,
4
thru Q
),
thru Q
6
6
6
6
o
4
4
4
4
C to 85
4
6
6
,
I
I
I
V
V
I
V
V
I
I
I
I
I
V
I
V
I
V
I
I
I
I
∆V
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
CB
EB
CB
EB
CE
CE
CE
= 10µA, I
= 100µA, I
= 100µA, I
= 10mA, V
= 10mA, V
= 20mA, V
= 10mA, V
= 20mA, V
= 5mA,
= 5mA,
= 5mA,
= 10mA, V
= 10mA, V
= 10mA, V
= 10mA, V
o
TEST
HFA3101
TEST CONDITIONS
C
= 1V, I
= 0, f = 1MHz
= 8V, I
= 5V, f = 1MHz
= 3V
= 3V
= 3V
= 5V
C
E
C
E
B
CE
CE
CE
CE
CE
CE
CE
CE
CE
= 0
= 0
= 0
f = 0.5GHz
f = 1.0GHz
f = 0.5GHz
f = 1.0GHz
f = 0.5GHz
f = 1.0GHz
= 0
= 0
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature (Die) . . . . . . . . . . . . . . . . . . .175
Maximum Junction Temperature (Plastic Package) . . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
= 3V
= 5V
= 5V
= 5V
= 5V
= 3V
= 3V
= 3V
= 3V
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
(NOTE 2)
LEVEL
TEST
A
A
A
A
A
A
C
B
C
C
C
C
C
C
C
C
C
C
A
A
A
C
B
MIN
5.5
0.9
12
40
8
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.300
0.600
0.200
0.400
TYP
17.5
11.9
2.25
0.01
0.1
1.7
2.0
2.5
1.0
1.5
0.5
18
12
70
10
10
6
5
5
5
-
MAX
200
1.1
10
25
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
o
θ
C to 150
JA
UNITS
µV/
185
GHz
GHz
GHz
GHz
(
mV
nA
nA
dB
dB
dB
dB
dB
dB
µA
nA
o
pF
pF
pF
pF
V
V
V
C/W)
o
C
o
o
o
o
C
C
C
C