LMV115MGX/NOPB National Semiconductor, LMV115MGX/NOPB Datasheet - Page 3

• Manufacturer Part Number: LMV115MGX/NOPB
• Description: IC CLOCK BUFFER SGL 30MHZ SC70-6
• Manufacturer: National Semiconductor

Specifications of LMV115MGX/NOPB

• Function: Oscillator Buffer
• Frequency: 30MHz
• Rf Type: GSM
• Secondary Attributes: 2.5V ~ 3.3V supply
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LMV115MGX

Z
V
I
I
R
O
SC
Symbol
IN
2.8V Electrical Characteristics
O
ON
Unless otherwise specified, all limits guaranteed for T
50kΩ to V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model (HBM) is 1.5kΩ in series with 100pF.
Note 3: Machine Model, 0Ω in series with 200pF.
Note 4: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C
Note 5: Infinite Duration; Short circuit test is a momentary test. See next note.
Note 6: The maximum power dissipation is a function of T
P
Note 7: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
T
Note 8: Typical Values represent the most likely parametric norm.
Note 9: All limits are guaranteed by testing or statistical analysis.
Note 10: Positive current corresponds to current flowing into the device.
Note 11: Slew rate is the average of the positive and negative slew rate.
Note 12: Average Temperature Coefficient is determined by dividing the change in a parameter at temperature extremes by the total temperature change.
J
D
>
= (T
T
A
J(MAX)
. See Applications section for information on temperature de-rating of this device.
Input Impedance
Output Swing Positive
Output Swing Negative
Linear Output Current
Output Short-Circuit Current
(Note 5)
Switch in ON Position
+
/2, C
-T
A
) / θ
L
JA
J
= 5pF to V
= T
. All numbers apply for packages soldered directly onto a PC board.
Parameter
A
. There is no guarantee of parametric performance as indicated in the electrical tables under conditions of internal self-heating where
+
/2 and C
COUPLING
f = 25MHz; Shutdown = 2.8V
f = 25MHz; Shutdown = 0V
R
R
No Load; V
(Sourcing)
No Load; V
(Sinking)
No Load; Sourcing to V
No Load; Sinking from V
L
L
= 1nF.Boldface limits apply at the temperature extremes.
J(MAX)
= 50kΩ to V
= 50kΩ to V
(Continued)
, θ
J
= 25˚C, V
JA
OUT
OUT
Conditions
, and T
+
+
= V
= V
/2
/2
3
A
+
+
−
. The maximum allowable power dissipation at any ambient temperature is
− 1.1V
+ 1.1V
= 2.8V, V
+
/2
+
/2
−
= 0V, V
(Note 9)
1.90
1.65
Min
−90
−35
100
−90
−35
100
CM
50
50
= V
+
/2, shutdown = 0.0V, and R
(Note 8)
−206
−186
2.38
2.47
2.16
1.05
Typ
205
191
21
(Note 9)
Max
1.35
1.30
40
45
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Units
kΩ
µA
µA
L
Ω
V
=