UPG2301T5L-E2-A CEL, UPG2301T5L-E2-A Datasheet

IC AMP BLUETOOTH 12TSQFN

UPG2301T5L-E2-A

Manufacturer Part Number
UPG2301T5L-E2-A
Description
IC AMP BLUETOOTH 12TSQFN
Manufacturer
CEL
Datasheet

Specifications of UPG2301T5L-E2-A

Current - Supply
120mA
Frequency
2.4GHz ~ 2.5GHz
Gain
23dB
Package / Case
12-TSQFN
Rf Type
Bluetooth
Voltage - Supply
2.7 V ~ 3.6 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
P1db
-
Test Frequency
-
Other names
UPG2301T5L-E2-ATR
Document No. PG10559EJ01V0DS (1st edition)
Date Published April 2005 CP(K)
DESCRIPTION
a 12-pin plastic TSQFN package, and is suitable for high-density surface mounting.
FEATURES
• Operation frequency
• Supply voltage
• Control voltage
• Circuit current
• Maximum power
• Gain Control Range
• Power gain
• High efficiency
• Shut down function
• High-density surface mounting : 12-pin plastic TSQFN package (2.0 × 2.0 × 0.37 mm)
APPLICATIONS
• Power Amplifier for Bluetooth Class 1 etc.
ORDERING INFORMATION
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
μ
PG2301T5L-E2
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
Remark To order evaluation samples, contact your nearby sales office.
The
This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed in
Part Number
μ
PG2301T5L is a GaAs HBT MMIC power amplifier for Bluetooth Class 1, and other ISM band applications.
your nearby sales office.
Part number for sample order:
μ
PG2301T5L-E2-A
Order Number
POWER AMPLIFIER FOR Bluetooth
: f
: V
: V
: V
: I
: P
: GCR = 23 dB TYP. @ V
: G
: PAE = 50% TYP. (Reference value)
P
P
P
opt
CC
CC
cont
enable
in
out (MAX.)
in
in
P
12-pin plastic TSQFN
(Pb-Free)
= +4 dBm
= +4 dBm
= +4 dBm
= 2 400 to 2 500 MHz (2 450 MHz TYP.)
= 120 mA TYP. @ V
= 23 dB TYP. (Reference value)
1, 2 = V
= 0 to 3.6 V (2.5 V TYP.)
= 0 to 3.1 V (2.9 V TYP.)
μ
Package
PG2301T5L-A
= +23 dBm TYP. @ V
bias
Note
= 2.7 to 3.6 V (3.3 V TYP.)
CC
CC
Marking
1, 2 = V
2301
1, 2 = V
GaAs HBT INTEGRATED CIRCUIT
CC
1, 2 = V
bias
bias
• Embossed tape 8 mm wide
• Pin 10, 11, 12 face the perforation side of the tape
• Qty 3 kpcs/reel
= 3.3 V, V
= 3.3 V, V
bias
μ
= 3.3 V, V
TM
cont
cont
PG2301T5L
Class 1
©
= 2.5 V, V
Supplying Form
= 0 to 2.5 V, V
NEC Compound Semiconductor Devices, Ltd. 2005
cont
= 2.5 V, V
enable
enable
= 2.9 V,
enable
= 2.9 V,
= 2.9 V,

Related parts for UPG2301T5L-E2-A

UPG2301T5L-E2-A Summary of contents

Page 1

POWER AMPLIFIER FOR Bluetooth DESCRIPTION μ The PG2301T5L is a GaAs HBT MMIC power amplifier for Bluetooth Class 1, and other ISM band applications. This device realizes high efficiency, high gain and high output power by using InGaP HBT. This ...

Page 2

PIN CONNECTIONS (Top View 2301 ABSOLUTE MAXIMUM RATINGS (T Parameter Symbol Supply Voltage Control Voltage V V enable Circuit Current I Control Current I cont I enable Power ...

Page 3

ELECTRICAL CHARACTERISTICS (T = +25° 3 450 MHz, External input and output matching, unless A CC bias otherwise specified) Parameter Symbol Circuit Current I Shut Down Current I shut down ...

Page 4

EVALUATION CIRCUIT ( INPUT μ 000 pF 1 000 pF The application circuits and their parameters are for reference only and are ...

Page 5

PACKAGE DIMENSIONS 12-PIN PLASTIC TSQFN (UNIT: mm) (C 0.17±0.07) 0.23±0.1 Remark ( ) : Reference value 2.0±0.1 (Bottom View) 0.50±0.06 0.94±0.1 Data Sheet PG10559EJ01V0DS μ PG2301T5L +0.03 0.37 –0.05 5 ...

Page 6

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at peak ...

Page 7

Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be ...

Page 8

... Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk ...

Related keywords