MCF5253CVM140 Freescale Semiconductor, MCF5253CVM140 Datasheet - Page 16

IC MPU 32BIT 140MHZ 225-MAPBGA

MCF5253CVM140

Manufacturer Part Number
MCF5253CVM140
Description
IC MPU 32BIT 140MHZ 225-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF525xr

Specifications of MCF5253CVM140

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
140MHz
Connectivity
CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Data Converters
A/D 6x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
225-MAPBGA
Family Name
MCF5xxx
Device Core
ColdFire V2
Device Core Size
32b
Frequency (max)
140MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2/3.3V
Operating Supply Voltage (max)
1.32/3.6V
Operating Supply Voltage (min)
1.08/3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
225
Package Type
MA-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant

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Electrical Specifications
Table 12
4.1
The SDRAM bus is a synchronous bus. Propagation delays, set-up times and hold times with respect to
the SDRAM clock BCLK are shown in
clock is not active, SDRAM interface is not valid and the external bus cannot be used.
16
Frequency
Frequency Tolerance
Frequency Stability Over Operating Temperature Range
ESR
Shunt Capacitance
Load Capacitance
shows the CRIN Crystal suggested parameters.
SDRAM Bus Timing
MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 4
Parameter
BCLKE, SDXDQM, SDWE,
SDCS0, SDRAS, SDCAS
Table 12. CRIN Crystal Suggested Parameters
Figure 4. SDRAM Bus Timing Diagram
data (write)
Figure 4
BCLK
A[24:9]
and the parameters provided in
data (read)
D3
D1
D2
D4
D5
Min
5
Typ
40
18
7
Table
Freescale Semiconductor
16.94
Max
±50
±50
13. When BCLK
MHz
Unit
ppm
ppm
pF
pF
Ω

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