AD604AR Analog Devices Inc, AD604AR Datasheet - Page 29

• Manufacturer Part Number: AD604AR
• Description: IC AMP VGA DUAL ULN 40MA 24SOIC
• Manufacturer: Analog Devices Inc
• Series: X-AMP®r

Specifications of AD604AR

• Amplifier Type: Variable Gain
• Number Of Circuits: 2
• Slew Rate: 170 V/µs
• -3db Bandwidth: 40MHz
• Current - Input Bias: 400nA
• Current - Supply: 32mA
• Current - Output / Channel: 40mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• For Use With: AD604-EVALZ - BOARD EVAL FOR AD604 AMP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• Voltage - Supply, Single/dual (±): -
• Gain Bandwidth Product: -
• Voltage - Input Offset: -

ORDERING GUIDE
Model
AD604ANZ
AD604AR
AD604AR-REEL
AD604ARZ
AD604ARZ-RL
AD604ARS
AD604ARS-REEL7
AD604ARSZ
AD604ARSZ-RL
AD604ARSZ-R7
AD604-EVALZ
1
Z = RoHS Compliant Part.
1
−40°C to +85°C
−40°C to +85°C
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
COPLANARITY
2.00 MAX
0.10
0.05 MIN
24
1
0.65 BSC
Figure 66. 24-Lead Shrink Small Outline Package [SSOP]
COMPLIANT TO JEDEC STANDARDS MO-150-AG
8.50
8.20
7.90
Package Description
24-Lead Plastic Dual In-Line Package [PDIP]
24-Lead Standard Small Outline Package [SOIC_W]
24-Lead Standard Small Outline Package [SOIC_W]
24-Lead Standard Small Outline Package [SOIC_W]
24-Lead Standard Small Outline Package [SOIC_W]
24-Lead Shrink Small Outline Package [SSOP]
24-Lead Shrink Small Outline Package [SSOP]
24-Lead Shrink Small Outline Package [SSOP]
24-Lead Shrink Small Outline Package [SSOP]
24-Lead Shrink Small Outline Package [SSOP]
Evaluation Board
Dimensions shown in millimeters
0.38
0.22
Rev. G | Page 29 of 32
13
12
(RS-24)
5.60
5.30
5.00
1.85
1.75
1.65
SEATING
PLANE
8.20
7.80
7.40
8°
4°
0°
0.25
0.09
0.95
0.75
0.55
Package Option
N-24-1
RW-24
RW-24
RW-24
RW-24
RS-24
RS-24
RS-24
RS-24
RS-24
AD604