AD8001ANZ Analog Devices Inc, AD8001ANZ Datasheet - Page 3

• Manufacturer Part Number: AD8001ANZ
• Description: IC OPAMP CF LP LDIST 70MA 8DIP
• Manufacturer: Analog Devices Inc

Specifications of AD8001ANZ

• Slew Rate: 1200 V/µs
• Amplifier Type: Current Feedback
• Number Of Circuits: 1
• -3db Bandwidth: 880MHz
• Current - Input Bias: 5µA
• Voltage - Input Offset: 2000µV
• Current - Supply: 5mA
• Current - Output / Channel: 70mA
• Voltage - Supply, Single/dual (±): ±3 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Op Amp Type: Current Feedback
• No. Of Amplifiers: 1
• Bandwidth: 800MHz
• Supply Voltage Range: ± 3V To ± 6V
• Amplifier Case Style: DIP
• No. Of Pins: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation @ 25°C
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 1.2 V
Output Short Circuit Duration
Storage Temperature Range N, R . . . . . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1
2
Model
AD8001AN
AD8001AQ
AD8001AR
AD8001AR-REEL
AD8001AR-REEL7
AD8001ART-REEL
AD8001ART-REEL7
AD8001ACHIPS
5962-9459301MPA
*
REV. D
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8001 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device in free air:
Standard Military Drawing Device.
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
8-Lead PDIP Package: θ
8-Lead SOIC Package: θ
8-Lead CERDIP Package: θ
5-Lead SOT-23-5 Package: θ
PDIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
SOIC (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 W
8-Lead CERDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 W
SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
*
JA
JA
= 90°C/W
= 155°C/W
JA
JA
= 110°C/W
= 260°C/W
Temperature
Range
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
2
1
ORDERING GUIDE
Package
Description
8-Lead PDIP
8-Lead CERDIP
8-Lead SOIC
13" Tape and REEL
7" Tape and REEL
13" Tape and REEL
7" Tape and REEL
Die Form
8-Lead CERDIP
S
–3–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8001 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately 150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
While the AD8001 is internally short circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves.
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature
2.0
1.5
1.0
0.5
0
–50
SOIC PACKAGE
–40
8-LEAD
–30
SOT-23-5 PACKAGE
–20
5-LEAD
–10
AMBIENT TEMPERATURE – C
0
PDIP PACKAGE
10
8-LEAD
Package
20 30 40
Option
N-8
Q-8
R-8
R-8
R-8
RT-5
RT-5
Q-8
WARNING!
CERDIP PACKAGE
8-LEAD
50 60
ESD SENSITIVE DEVICE
T
J
AD8001
= +150 C
70
80
Branding
HEA
HEA
90