AMP03GPZ Analog Devices Inc, AMP03GPZ Datasheet - Page 3

• Manufacturer Part Number: AMP03GPZ
• Description: IC AMP DIFF PREC LDIST 45MA 8DIP
• Manufacturer: Analog Devices Inc
• Type: Differential Ampr

Specifications of AMP03GPZ

• Amplifier Type: Differential
• Number Of Circuits: 1
• Slew Rate: 9.5 V/µs
• -3db Bandwidth: 3MHz
• Voltage - Input Offset: 25µV
• Current - Supply: 2.5mA
• Current - Output / Channel: 45mA
• Voltage - Supply, Single/dual (±): ±6 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Number Of Channels: 1
• Number Of Elements: 1
• Power Supply Requirement: Dual
• Common Mode Rejection Ratio: 80dB
• Input Offset Voltage: 0.75@±15VmV
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): 15V
• Power Supply Rejection Ratio: 123.1dB
• Rail/rail I/o Type: No
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (max): ±18V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 8
• Package Type: PDIP
• Bandwidth: 3 MHz
• Current, Supply: 2.5 mA
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Input: ±20 V
• Voltage, Input Offset: +25 μV
• Voltage, Output Swing: ±13.7 V
• Voltage, Supply: ±18 V
• No. Of Amplifiers: 1
• Gain Db Max: 1dB
• Supply Voltage Range: ± 6V To ± 18V
• Supply Current: 3mA
• Amplifier Case Style: DIP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Current - Input Bias: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

Parameter
Offset Voltage
Gain Error
Input Voltage Range
Common-Mode Rejection
Power Supply Rejection Ratio
Output Swing
Short-Circuit Current Limit
Supply Current
*Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Input Voltage
Output Short-Circuit Duration . . . . . . . . . . . . . . Continuous
Storage Temperature Range
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . 300°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Operating Temperature Range
Package Type
Header (J)
8-Lead PDIP (P)
8-Lead SOIC (S)
NOTES
1
2
3
Model
AMP03GP
AMP03BJ
AMP03FJ
AMP03BJ/883C
AMP03GS
AMP03GS-REEL
5962-9563901MGA –55°C to +125°C Header
AMP03GBC
NOTES
1
2
WAFER TEST LIMITS
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AMP03 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. F
Absolute maximum ratings apply to both DICE and packaged parts, unless
For supply voltages less than ± 18 V, the absolute maximum input voltage is equal
θ
Burn-in is available on commercial and industrial temperature range parts in
Consult factory for /883 data sheet.
PDIP and header packages.
otherwise noted.
to the supply voltage.
in socket for header and PDIP packages and for device soldered to printed circuit
board for SOIC package.
JA
P, J Package . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
AMP03B . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
AMP03F, AMP03G . . . . . . . . . . . . . . . . . . –40°C to +85°C
is specified for worst-case mounting conditions, i.e., θ
1
2
. . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C Header
–40°C to +85°C
–40°C to +85°C
ORDERING GUIDE
(@ V
150
103
155
JA
3
S
Package
Description
8-Lead PDIP
Header
Header
8-Lead SOIC
8-Lead SOIC
Die
=
1
Symbol
V
IVR
CMR
PSRR
V
I
I
SC
SY
OS
O
15 V, T
JA
18
43
40
JC
is specified for device
A
= 25 C, unless otherwise noted.)*
Package
Option
P-8
H-08B
H-08B
H-08B
S-8
S-8
H-08B
Unit
°C/W
°C/W
°C/W
V
Conditions
V
No Load, V
V
R
Output Shorted to Ground
No Load
S
CM
S
L
= ± 18 V
= ± 6 V to ± 18 V
= 2 kΩ
2
= ± 10 V
–3–
DICE CHARACTERISTICS
BURN-IN CIRCUIT
SLEW RATE TEST CIRCUIT
IN
= ± 10 V, R
V
IN
DIE SIZE 0.076 inch
=
S
10V
= 0 Ω
25k
(1.93 mm
25k
1.93 mm, 3.73 sq. mm)
AMP03GBC
0.076 inch, 5,776 sq. mm
–15V
+15V
+18V
–18V
Limit
0.5
0.008
± 10
80
8
± 12
+45/–15
3.5
AMP03
WARNING!
AMP03
0.1 F
0.1 F
25k
ESD SENSITIVE DEVICE
1. REFERENCE
2. –IN
3. +IN
4. –V
5. SENSE
6. OUTPUT
7. +V
8. NC
V
OUT
EE
CC
=
Unit
mV max
% max
V min
dB min
µV/V max
V max
mA min
mA max
AMP03
10V